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A kind of accompanying plate applied to graphic electroplating vcp process and its manufacturing method

A graphic electroplating and manufacturing method technology, applied in electrolytic components, electrolytic process, current conduction device, etc., can solve the problems of thinner copper layer of production board, reduce production cost, and reduce the area to be plated, so as to reduce the area to be plated Small size, reduced production cost, cost reduction effect

Active Publication Date: 2018-10-02
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the problem that the use of the existing accompanying plating plate will lead to the quality hidden dangers of the production plate such as thin copper layer and tin dissolution, and the loss of copper ball and tin ball material will roughly increase the production cost, and provides a VCP applied to graphic electroplating. The accompanying plating plate of the process and its manufacturing method, the accompanying plating plate can ensure the uniformity of the thickness of the electroplated copper layer and the tin layer of the production plate, ensure the production quality of the production plate, and reduce the plated area of ​​the accompanying plate , thereby reducing the loss of copper balls and tin ball materials for electroplating, and reducing production costs

Method used

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  • A kind of accompanying plate applied to graphic electroplating vcp process and its manufacturing method
  • A kind of accompanying plate applied to graphic electroplating vcp process and its manufacturing method
  • A kind of accompanying plate applied to graphic electroplating vcp process and its manufacturing method

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Embodiment 1

[0024] Such as figure 1 and figure 2 Shown, a kind of accompanying plating plate that is applied to pattern electroplating VCP process shown in the present embodiment, accompanying plating plate is L type accompanying plating plate 1, comprises insulating base material layer 3, and the upper and lower surfaces of base material layer 3 are all provided with There is a copper layer, and the copper layer is an L-shaped copper layer 2 located on the adjacent two sides of the substrate layer 3; the side width of the L-shaped copper layer 2 is 5 cm; the L-shaped copper layer 2 on the upper and lower surfaces of the substrate layer 3 is a mirror image up and down correspond.

[0025] The above-mentioned accompanying plate applied to the pattern electroplating VCP process has a plated area of ​​less than 10dm on one side of the production plate 2 used when.

[0026] When the plated area on one side of the production board is less than 10dm 2 , the size of the production board is ...

Embodiment 2

[0034] This embodiment provides a method for manufacturing an L-shaped accompanying plate applied to the pattern electroplating VCP process. This method is basically the same as that in Embodiment 1, except that the thickness of the copper clad plate in step a is 1.6 mm.

[0035] When the L-shaped accompanying plate of this embodiment is in use, the height difference between the L-shaped accompanying plate and the production plate in the VCP equipment should not exceed 2cm.

Embodiment 3

[0037] This embodiment provides a method for manufacturing an L-shaped accompanying plate applied to the pattern electroplating VCP process. The method is basically the same as that in Embodiment 1, except that the thickness of the copper clad plate in step a is 2 mm.

[0038] When the L-shaped accompanying plate of this embodiment is in use, the height difference between the L-shaped accompanying plate and the production plate in the VCP equipment should not exceed 2cm.

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Abstract

The invention discloses an accompanying plating plate applied to a graphic electroplating VCP process and a manufacturing method thereof. The accompanying plating plate is an L-shaped accompanying plating plate, which includes an insulating base material layer, and the upper and lower surfaces of the base material layer are provided with There is a copper layer, and the copper layer is an L-shaped copper layer arranged on the adjacent two sides of the base layer; when the area to be plated on one side of the production board is less than 10dm2, the accompanying plate adopts the above-mentioned L-shaped accompanying plate, and the L-shaped The production method of the accompanying plated board includes the following steps: cutting out the copper clad board according to the size of the production board, sticking a film on the copper surface of the copper clad board, using a fully automatic exposure machine, and sequentially coating photosensitive paint on both sides of the film, exposing, and developing. L shape, etch off the excess copper layer outside the L shape on the copper clad board, and then remove the film to make an L-shaped accompanying plated board. Through the use of the accompanying plated plate of the present invention, the uniformity of the thickness of the electroplated copper layer and the tin layer of the production plate can be ensured, the production quality of the production plate can be ensured, and the loss of copper balls and tin ball materials used for electroplating can be reduced, and the production cost can be reduced. .

Description

technical field [0001] The invention relates to the technical field of producing accompanying plating plates, in particular to an accompanying plating plate applied to a graphic electroplating VCP process and a manufacturing method thereof. Background technique [0002] Vertical continuous electroplating (VCP) process is commonly used in the electroplating process of printed circuit boards. One of the characteristics of this electroplating process is that it requires continuous current flow, so that the first and last production boards must be adjacent to the accompanying plating boards with the same size as the production board. Only by electroplating can the normal current electroplating of the production board be carried out. At present, most manufacturers directly use copper-clad laminates as accompanying plates. Metal is plated on the surface of the accompanying plates during electroplating. [0003] The VCP equipment for graphic electroplating is continuous. As the ar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/00C25D7/00
CPCC25D7/00C25D17/007
Inventor 徐文中李江张义兵汪广明
Owner JIANGMEN SUNTAK CIRCUIT TECH