A kind of accompanying plate applied to graphic electroplating vcp process and its manufacturing method
A graphic electroplating and manufacturing method technology, applied in electrolytic components, electrolytic process, current conduction device, etc., can solve the problems of thinner copper layer of production board, reduce production cost, and reduce the area to be plated, so as to reduce the area to be plated Small size, reduced production cost, cost reduction effect
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Embodiment 1
[0024] Such as figure 1 and figure 2 Shown, a kind of accompanying plating plate that is applied to pattern electroplating VCP process shown in the present embodiment, accompanying plating plate is L type accompanying plating plate 1, comprises insulating base material layer 3, and the upper and lower surfaces of base material layer 3 are all provided with There is a copper layer, and the copper layer is an L-shaped copper layer 2 located on the adjacent two sides of the substrate layer 3; the side width of the L-shaped copper layer 2 is 5 cm; the L-shaped copper layer 2 on the upper and lower surfaces of the substrate layer 3 is a mirror image up and down correspond.
[0025] The above-mentioned accompanying plate applied to the pattern electroplating VCP process has a plated area of less than 10dm on one side of the production plate 2 used when.
[0026] When the plated area on one side of the production board is less than 10dm 2 , the size of the production board is ...
Embodiment 2
[0034] This embodiment provides a method for manufacturing an L-shaped accompanying plate applied to the pattern electroplating VCP process. This method is basically the same as that in Embodiment 1, except that the thickness of the copper clad plate in step a is 1.6 mm.
[0035] When the L-shaped accompanying plate of this embodiment is in use, the height difference between the L-shaped accompanying plate and the production plate in the VCP equipment should not exceed 2cm.
Embodiment 3
[0037] This embodiment provides a method for manufacturing an L-shaped accompanying plate applied to the pattern electroplating VCP process. The method is basically the same as that in Embodiment 1, except that the thickness of the copper clad plate in step a is 2 mm.
[0038] When the L-shaped accompanying plate of this embodiment is in use, the height difference between the L-shaped accompanying plate and the production plate in the VCP equipment should not exceed 2cm.
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Abstract
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