High-performance liquid thermal transfer printing electric conduction adhesive production method

Abstract

The present invention belongs to the technical field of electromagnetic shielding electric conduction adhesives, and provided a high-performance liquid thermal transfer printing electric conduction adhesive production method, which comprises: preparing an ethanol mixing liquid with a content of 20% from 3-glycidyl propyltrimethoxysilane; selecting nickel coated graphite electric conduction powder with an average particle size of 40-250 [mu]m, adding 100 parts of the selected nickel coated graphite electric conduction powder to 5 parts of the ethanol mixing liquid, and completely mixing and uniformly stirring for 20 min; carrying out vacuum stirring treatment for 5 min; carrying out heating stirring dispersion for 15 min at a temperature of 100-120 DEG C; pouring 70 parts of a 100000 mPa vinyl silica gel-based adhesive, and carrying out dispersion and uniform mixing for 30 min; and cooling to a normal temperature, and carrying out dispersion stirring for 30 min. According to the embodiments of the present invention, the vinyl silica gel-based adhesive is adopted as the substrate, the 3-glycidyl propyltrimethoxysilane is adopted as the coupling agent, and the solvent capable of enhancing the electric conductivity is not used during the electric conduction adhesive raw material preparation process, such that the warm and wet gas affecting the air quality cannot be discharged during the subsequent vulcanization molding process of the liquid electric conduction adhesive so as to protect the environment.

Description

technical field [0001] The invention belongs to the technical field of electromagnetic shielding conductive adhesives, and in particular relates to a method for preparing high-performance liquid thermal transfer conductive adhesives. Background technique [0002] Electromagnetic compatibility is essential for high-frequency electronic equipment. Communication base station equipment has developed from 2G to 3G to today's 4G and soon 5G. The market is developing rapidly and the usage is increasing. The quality and quantity requirements for conductive adhesives are getting higher and higher. [0003] Existing liquid conductive adhesives are used through an on-site dispensing and molding technique (FIP), and a numerically controlled dispenser is used to coat the conductive adhesive strips on the cavity shell ribs that need to be shielded and sealed. [0004] Since the dispensing molding technology FIP needs to be vulcanized, in order to increase the fluidity of the conductive r...

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Problems solved by technology

[0005] The embodiment of the present invention provides a method for making high-performance liquid thermal transfer conductive adhesive, which aims to solve the problem of vulcanization treatment due to the use of dispensing molding technology FIP when the existing liquid conductive adhesive is used, in order to increase the fluidity of the conductive adhesive And to enhance the conductivity after vulcanization, a large amount of solvent is added to the rubber compound, about 5%-10%. This solvent emits obvious warm and humid gas during vulcanization molding, pollutes the atmosphere, and affects air quality.

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