Array key, cutting mold, packing structure and key production method

Abstract

The invention provides an array key, a cutting mold, a packing structure and a key production method. The array key comprises multiple key bodies and a bracket; the multiple key bodies are arranged in an array, and are connected through connecting parts; the bracket is connected with the key bodies through the connecting parts, and is used for supporting the key bodies; and the bracket is provided with a positioning hole for positioning the array key in the machining process. The multiple key bodies are supported through the bracket, and the bracket is provided with the positioning hole for positioning the array key in the machining process, so that keys obtained by cutting the array key are arranged according to preset sequence and positions, a secondary vibration separation process step is saved, the damage and the pollution of the keys caused by the vibration separation are prevented when guaranteeing correct sequence and positions of the keys, and the reliability of the keys in the use process is guaranteed.

Description

technical field [0001] The invention relates to the technical field of buttons, in particular to an array button, a cutting mold, a packaging structure and a button production method. Background technique [0002] At present, in the related technology, the braiding method of the elastic button needs to firstly remove the welding protective cover from the semi-finished product of the array type elastic button element formed by molding, and punch it into a single patch type elastic button element, and then the patch type The bulk material of the elastic button components is put into the vibrating plate, and the button components are accurately landed on the card position through vibration, and then the direction of the buttons is determined and corrected, and then enters the steps of quality inspection and packaging. On the one hand, a single patch-type elastic button component needs to undergo processes such as punching, bulk material accumulation, and vibration feeding, whic...

AI Technical Summary

Problems solved by technology

On the one hand, a single patch-type elastic button component needs to undergo processes such as punching, bulk material accumulation, and vibration feeding, which not only easily affects the coplanarity of the solder feet of the button, but also easily causes surface contamination of the solder feet, which directly affects the surface of the patch. On the other hand, because the shape of the patch-type silicone elastic key is different from that of general electronic components, and because of its inherent elastic characteristics, it is difficult to use a vibrating plate to carry out the die-cut silicone elastic key. When taping and packaging, the key is accurately vibrated to the delivery card position and the loading speed is slow. In addition, after the key enters the card position, it needs to be further judged and the direction corrected before entering the final quality inspection and packaging steps.

It can be seen that the existing tape packaging method for electronic components is used in the tape packaging of patch type elastic button components.

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