Improved bearing disc and bearing device

Abstract

The invention discloses an improved bearing disc and a bearing device. The bearing disc comprises a main body plate and a limiting piece used for being installed in cooperation with a bearing frame, wherein the limiting piece is arranged on the bottom surface of the main body plate, and the outer contour of the limiting piece corresponds to the inner contour of a bearing groove in the bearing frame; and a right-angle vent hole is formed in the storage groove, the right-angle vent hole comprises a horizontal section and a vertical section, an outlet of the horizontal section is formed in the inner wall of the storage groove, and an outlet of the vertical section is formed in the bottom of the main body plate. In the embodiment, the horizontal section is rectangular, and the vertical sectionis long circular. According to the bearing disc, air between the storage groove and the silicon wafer can be smoothly exhausted, and the machining quality of the silicon wafer can be guaranteed.

Description

technical field [0001] The invention relates to a cell sheet processing and transportation equipment, in particular to an improved carrying plate and carrying device. Background technique [0002] The production process of solar silicon wafers generally includes silicon wafer inspection, surface texturing and pickling, diffusion junction, phosphorus silicon glass removal, plasma etching and pickling, anti-reflection coating, screen printing and rapid sintering, etc. In the process of production and processing, generally a plurality of silicon wafers to be processed are placed on the silicon wafer carrying frame, and then the entire silicon wafer carrying frame is connected and installed on the transportation track, and the movement of the silicon wafer carrying frame drives the silicon wafer in each The transfer between processing stations, so as to realize the batch processing of silicon wafers. The general silicon chip carrier frame on the market is equipped with a plural...

AI Technical Summary

Problems solved by technology

In addition, for a specific silicon wafer processing technology, for example, when the coating layer of the silicon wafer is thin, the supporting plate is used to complete the support of the silicon wafer to ensure that the coating of the silicon wafer is protected during processing and the silicon wafer can be evenly heated etc., for example, the utility model patent "a silicon chip carrying plate and a silicon chip carrying device" whose authorized announcement number is CN209963035U; however, when the carrying plate is used as a loading tool, since the bottom surface of the carrying plate is sealed, the silicon When the chip is placed on the storage slot of the carrier tray, it needs to be ventilated, that is, the air between the silicon chip and the storage slot is discharged, so as to ensure that the silicon chip is placed in the storage slot, thereby ensuring the position accuracy of the silicon chip, submit Processing quality; in order to solve the exhaust problem, the conventional method is to directly set a vent hole on the storage slot of the carrier plate, and the vent hole runs through the space below the storage slot and the carrier plate to achieve the exhaust effect; but such an exhaust method , leading to the exposure of the bottom of the silicon wafer corresponding to the vent hole, which is easily polluted by dust or other impurities during processing, which affects the processing effect

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