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Low-formaldehyde chipboard and preparation method thereof

A particleboard and low-formaldehyde technology, applied in the field of low-formaldehyde particleboard and its preparation, can solve the problems of large formaldehyde emission from all-urea-formaldehyde-adhesive particleboard, long production cycle of all-soybean gum particleboard, reduction of formaldehyde emission from particleboard, etc., and shortens hot pressing. Time, ease of industrial production, and the effect of improving production efficiency

Inactive Publication Date: 2017-07-28
宁波中科朝露新材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a low-formaldehyde particleboard, which can not only solve the problem of large amount of formaldehyde released from all-urea-formaldehyde particleboard, but also solve the problem of long production cycle of all-soybean glue particleboard, that is, formaldehyde-free soybean glue is used for surface sizing, core The layer sizing uses urea-formaldehyde glue. Since the amount of urea-formaldehyde glue used is reduced, and the urea-formaldehyde glue in the core layer is embedded in the board, it can greatly reduce the formaldehyde emission of the particleboard, reaching the Japanese F★★★★ standard, and also It can ensure the production efficiency of the particleboard, the mechanical properties of the particleboard and other indicators can meet the national standards

Method used

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  • Low-formaldehyde chipboard and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Formaldehyde-free soybean gum raw material proportioning by weight is as follows:

[0030] Low-temperature defatted soybean powder (commercially available): 30 parts

[0031] Crosslinking agent (silane coupling agent KH570): 4.8 parts

[0032] Acid-base regulator (sodium hydroxide): 0.2 parts

[0033] Tackifier (15% concentration of polyvinyl alcohol solution): 20 parts

[0034] Water: 45 parts.

[0035] Set the density of the particleboard to 700kg / m 3 , before sizing, use low-temperature defatted soybean powder as a powder component, mix crosslinking agent, acid-base regulator, tackifier, and water evenly, and use formaldehyde-free soybean gum and surface shavings according to the weight ratio The ratio is 28:100, for sizing, the powder component is added to the mixing bin and mixed evenly with the shavings by means of spiral weighing and metering, and at the same time, the liquid component is sprayed onto the surface of the shavings in the mixing bin. The urea-f...

Embodiment 2

[0038] The ratio of formaldehyde-free soybean gum raw materials by weight is as follows:

[0039] Low-temperature defatted soybean flour: 28 servings

[0040] Crosslinking agent (epoxy resin): 5 parts

[0041] Acid-base regulator (oxalic acid): 0.3 parts

[0042] Tackifier (rosin emulsion with 30% solid content): 23.7 parts

[0043] Water: 43 parts.

[0044] Set the density of the particleboard to 710kg / m 3 , before sizing, use low-temperature defatted soybean powder as a powder component, mix crosslinking agent, acid-base regulator, tackifier, and water evenly, and use formaldehyde-free soybean gum and surface shavings according to the weight ratio The ratio is 30:100, for sizing, the powder component is added into the mixing bin and mixed evenly with the shavings by means of spiral weighing and metering, and at the same time, the liquid component is sprayed onto the surface of the shavings in the mixing bin. The urea glue and the core layer shavings were applied according...

Embodiment 3

[0047] The ratio of formaldehyde-free soybean gum raw materials by weight is as follows:

[0048] Low temperature defatted soybean flour: 25 parts

[0049] Crosslinking agent (epoxy resin): 6 parts

[0050] Acid-base regulator (calcium hydroxide): 0.5 parts

[0051] Tackifier (rosin emulsion with 40% solid content): 30 parts

[0052] Water: 38.5 parts.

[0053] Set the density of the particleboard to 690kg / m3. Before sizing, use low-temperature defatted soybean powder as the powder component, mix the cross-linking agent, acid-base regulator, tackifier, and water evenly, and use it as the liquid component. The aldehyde soybean gum and the surface layer shavings are sizing according to the weight ratio of 30:100. The powder component is added into the mixing bin and mixed with the shavings evenly by means of spiral weighing and metering. At the same time, the liquid component is sprayed into the mixing chamber. Surface of shavings in the silo. The urea glue and the core lay...

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Abstract

The invention discloses low-formaldehyde chipboard and a preparation method thereof. The low-formaldehyde chipboard comprises a surface layer and a core layer, wherein the surface layer adopts formaldehyde-free soybean glue as an adhesive; the dosage of the formaldehyde-free soybean glue is 15-40% of weight of wood shavings on the surface layer; the core layer adopts urea-formaldehyde glue as an adhesive; and the dosage of the urea-formaldehyde glue is 8-20% of weight of wood shavings on the core layer. The low-formaldehyde chipboard reduces the formaldehyde release amount of full-urea-formaldehyde glue chipboard and ensures the production efficiency of the chipboard; and the mechanical property and various indexes of the chipboard can reach the national standard requirements, and the low-formaldehyde chipboard is low in formaldehyde release amount and reaches the grade of F four solid pentalphas (the supreme grade of four grades in F series standard in Japan).

Description

technical field [0001] The invention relates to the field of wood-based panel processing, in particular to a low-formaldehyde particleboard and a preparation method thereof. Background technique [0002] Particleboard is one of the important products in the wood-based panel industry. In 2012, the output of particleboard in my country was 23.5 million m 3 , compared with 11.42 million m in 2008 3 doubled. Particleboard in my country is mainly used in furniture and cabinet making in the home furnishing field. In recent years, with the improvement of the quality of particleboard, particleboard has been used more and more in furniture, especially wardrobe cabinets. Urea-formaldehyde glue (UF) has the advantages of low cost, good use manufacturability, good bonding performance, and certain water resistance, so most factories in my country are using urea-formaldehyde glue to produce particleboards, but domestic particleboards produced with urea-formaldehyde glue are mostly It is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N3/02B27N3/00B27N1/02B27N3/08C08L89/00C08L29/04C08L63/00C08L93/04C08K3/22C08K5/092
CPCB27N3/02B27N1/0209B27N3/002B27N3/08C08L89/00C08L2205/03C08L29/04C08K3/22C08L63/00C08L93/04C08K5/092
Inventor 彭顺桂成胜刘小青林新青肖兆麟张忠涛张建辉朱锦徐益忠
Owner 宁波中科朝露新材料有限公司
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