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Heat dissipation device and terminal

A technology for heat dissipation equipment and terminals, which is applied to the structural parts of electrical equipment, cooling/ventilation/heating renovation, electrical components, etc. Effect

Active Publication Date: 2017-07-28
HUAWEI MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of this application is to provide a heat dissipation device and terminal, which can solve the problem of low utilization of radiators in the prior art

Method used

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  • Heat dissipation device and terminal
  • Heat dissipation device and terminal
  • Heat dissipation device and terminal

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Experimental program
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Embodiment Construction

[0022] In order to reduce the high temperature of the high power consumption chip in the terminal during operation, a heat sink is usually installed near the high power consumption chip, such as figure 1 As shown, the loop heat pipe radiator is the most widely used at present. The loop heat pipe radiator is composed of an evaporator, a condenser and related pipelines. The refrigerant circulates in the evaporator, condenser and related pipelines. The evaporator Set above the high power consumption chip, the refrigerant absorbs heat and vaporizes in the evaporator, flows into the condenser, releases heat and liquefies in the condenser, and then flows back to the evaporator, thus completing a refrigeration cycle; The heat generated by the high power consumption chip is transferred to the condenser, and finally dissipates the heat to the environment through the condenser.

[0023] The heat absorbed per unit time by a single evaporator is much higher than the heat generated per uni...

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PUM

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Abstract

The application discloses a heat dissipation device for use in a terminal and a terminal. The heat dissipation device comprises a heat conducting device and a first radiator. The heat conducting device is connected with at least two high power chips in the terminal. The first radiator is connected with the heat conducting device. The heat conducting device is used to absorb the heat generated by the at least two high power chips in the terminal and conduct the absorbed heat to the first radiator for heat dissipation. The heat conducting device in the application has thermal conductivity for absorbing the heat generated by the at least two high power chips and conducting the heat to the first radiator so that the at least two high power chips can share the first radiator for heat dissipation, the heat absorption capacity of the first radiator is effectively used, and the utilization rate of loop heat pipe radiator is improved.

Description

technical field [0001] The present application relates to the technical field of terminals, in particular to a heat dissipation device and a terminal. Background technique [0002] The high power consumption chips in the terminal (such as the central processing unit, etc.) will generate a lot of heat during operation, and once the surface temperature of the high power consumption chip is too high, it will affect its work efficiency and reliability. Therefore, for high power The most critical issue during the operation of the chip is the heat dissipation problem. [0003] In the prior art, the heat dissipation problem is solved by installing a heat sink near the high power consumption chip. The heat sink is mainly composed of a heat absorbing device, a cooling device and related pipelines. A heat absorbing device is arranged near the high power consumption chip, and the heat absorbing device will absorb the heat generated by the high power consumption chip, and conduct the h...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20336
Inventor 杨宝海池善久
Owner HUAWEI MACHINERY