Curable epoxy resin composition
A technology for curing epoxy resin and epoxy resin, which can be used in epoxy resin coatings, coatings, etc., and can solve problems such as high viscosity
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preparation example Construction
[0051] The preparation of the improved epoxy resins of the present invention and / or any step thereof may be a batch or continuous process. The mixing equipment used in the method can be any vessel and ancillary equipment well known to those skilled in the art.
[0052] Some advantages of using the improved epoxy resins of the present invention to produce final products may include, for example, final products having higher weight solids content and lower volatile organic compound (VOC) content.
[0053] Use of the improved epoxy resins of the present invention provides an end product exhibiting a good balance of performance properties such as higher mechanical strength properties, high temperature properties and higher chemical resistance properties. Use of the improved epoxy resins of the present invention also provides final product resins that exhibit desirable properties for various applications. For example, the improved epoxy resins of the present invention are particul...
example
[0092] The following examples further illustrate the invention, but should not be construed as limiting its scope. All parts and percentages are by weight unless otherwise indicated.
[0093] Various terms, names and materials used in the following examples are described in Table I.
[0094] Table I--Raw Materials
[0095]
[0096]
[0097] In the following examples, the following standard analytical equipment and methods were used:
[0098] viscosity
[0099] The viscosity of the curable compositions was measured according to the method of ASTM D445 using a Brookfield CAP-2000+ with a No. 6 spindle.
[0100] Epoxide Equivalent Weight (EEW)
[0101] The epoxide equivalent weight (EEW) of the epoxy resin compound used in the curable composition was determined according to the test method of ASTM D1652 by using a Mettler Toledo T70 titrator.
[0102] Decomposition temperature (Td)
[0103] Using the TGA Q50 of TA Instruments, according to the method of IPC-TM...
example 1
[0144] Example 1--synthetic improved epoxy resin
[0145] D.E.R. 383 epoxy resin (72.0 g), adipic acid (14.6 g) and CNSL (HD-F170, cardanol >85%, 18.0 g) were charged into a tank equipped with a mechanical stirrer, condenser tube and nitrogen charging adapter. Four-neck glass flask reactor. After slowly increasing the temperature of the reactor to 130°C, the temperature was kept constant for 5 minutes. The flask was then charged with 500 parts per million (ppm) ethyltriphenylphosphonium acetate (70% solution in methanol). The reaction temperature of the reaction mixture was subsequently increased to 160°C. The EEW of the reaction mixture was monitored during the reaction. The reaction stopped after 2 hours. The resulting product appeared to be clear and viscous by visual observation. The EEW of the resulting product was measured to be 799 g / eq.
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Abstract
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