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Manufacturing method of thermally conductive sheet, thermally conductive sheet, and semiconductor device

A manufacturing method and technology of thermal conductive sheet, which can be applied in semiconductor devices, semiconductor/solid-state device parts, cooling/ventilation/heating transformation, etc., can solve the problems of complicated installation process, etc., and achieve excellent installation properties, improved adhesion, and thermal conductivity. Excellent effect

Active Publication Date: 2019-07-12
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if such an adhesive sheet or adhesive is interposed, the mounting process will become complicated.

Method used

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  • Manufacturing method of thermally conductive sheet, thermally conductive sheet, and semiconductor device
  • Manufacturing method of thermally conductive sheet, thermally conductive sheet, and semiconductor device
  • Manufacturing method of thermally conductive sheet, thermally conductive sheet, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0150] In Example 1, alumina particles with an average particle diameter of 4 μm (thermally conductive particles: manufactured by Denki Kagaku Kogyo Co., Ltd.) and pitch-based carbon fibers with an average fiber length of 150 μm and an average fiber diameter of 9 μm were subjected to coupling treatment using a silane coupling agent (Thermal conductive fiber: manufactured by Nippon Grafiet Faiber Co., Ltd.) and aluminum nitride with an average particle size of 1 μm (thermally conductive particles: manufactured by Tokuyama Co., Ltd.) subjected to coupling treatment with a silane coupling agent in a two-liquid addition Among the reaction-type liquid silicone resins, the addition-reaction liquid silicone resin that is two-component by volume ratio: Alumina particles: Pitch-based carbon fibers: Aluminum nitride = 34vol%: 20vol%: 22vol%: 24vol% , A silicone resin composition (thermally conductive resin composition) was prepared. The two-component addition reaction type liquid silico...

Embodiment 2

[0154] In Example 2, as a two-component addition reaction type liquid silicone resin, a mixture of 40% by mass of the silicone A liquid and 60% by mass of the silicone B liquid was used. Under the same conditions, a thermal conductive sheet sample was fabricated.

Embodiment 3

[0156] In Example 3, as a two-component addition reaction type liquid silicone resin, a mixture of 45% by mass of the silicone A liquid and 55% by mass of the silicone B liquid was used. Under the same conditions, a thermal conductive sheet sample was fabricated.

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Abstract

A method for producing a heat-conducive sheet, comprising: a molded article production step of molding a heat-conductive resin composition comprising a binder resin and a heat-conductive filler into a desired shape and then curing the molded product to produce a molded article made from the heat-conductive resin composition; a molded article sheet production step of cutting the molded article into a sheet-like shape to produce a molded article sheet in which the heat-conducive filler is protruded on the surface of the sheet; and a pressing step of pressing the molded article sheet so that the surface of the molded article sheet is coated with an oozed component that is oozed from the molded article sheet in such a manner that the oozed component can follow the protruded shape formed by the protruded heat-conductive filler on the surface of the molded article sheet.

Description

technical field [0001] The present invention relates to a method of manufacturing a heat transfer sheet arranged between a heat source such as a semiconductor element and a heat dissipation member such as a heat sink, a heat transfer sheet, and a semiconductor device including the heat transfer sheet. Background technique [0002] In the past, semiconductor elements installed in various electronic devices such as personal computers or other devices generate heat due to driving. When the generated heat accumulates, it will have a bad influence on the driving of semiconductor elements or peripheral devices. Therefore, various means of cooling. As a cooling method for electronic components such as semiconductor elements, the following methods are known: installing a fan in the instrument to cool the air in the instrument casing; installing heat sinks or heat sinks in the semiconductor elements that should be cooled etc. heat sink method etc. [0003] When a heat sink is attac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/36B29C43/02C08J5/18H05K7/20
CPCH01L2224/16225H01L2224/73253H01L2924/16152
Inventor 荒卷庆辅菅原麻纱子内田俊介
Owner DEXERIALS CORP
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