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Automobile LED headlamp

A technology of headlights and LED chips, which is applied in the direction of headlights, lighting devices, vehicle parts, etc., can solve the problems of not meeting user requirements, shortening life, and large fastening force, so as to avoid current mutual influence and protect Printed circuit, the effect of fast heat conduction

Inactive Publication Date: 2017-08-04
GUANGZHOU RIXIONG ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Traditional automotive LED headlights use two substrates equipped with LED chips 10 to be assembled back-to-back in order to achieve 360° light emission. However, the substrate itself needs to have a certain thickness to ensure stable structure and good heat dissipation, and this thickness At least 2 mm or more, so the blind area of ​​the car LED headlight will be very large due to the blocking of the substrate, which cannot meet the user's requirements
Moreover, screws are used to fasten the substrate and the substrate. This method requires the fastening force provided by the screw to be large. Otherwise, the LED chip will be separated from the substrate due to vibration, which will cause the LED chip to burn out or shorten the life.
To increase the fastening force of the screw, it is necessary to increase the backing plate to balance the force, and apply a large pressure on the backing plate on both sides of the substrate to ensure that the process requirements are met. At this time, there are requirements for the thickness of the backing plate. If the backing plate is too thin , it may be crushed because it cannot withstand high pressure, so it is necessary to increase the thickness of the backing plate, and increasing the thickness of the backing plate will block the light because the backing plate is too thick, which will affect the LED lighting type.

Method used

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  • Automobile LED headlamp
  • Automobile LED headlamp
  • Automobile LED headlamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1 , 2 As shown in , 3, a kind of automobile LED headlamp of the present embodiment includes a substrate 20, an LED chip 10 arranged on the substrate 20, and a fixed heat conduction tube 40, and the substrate 20 is a metal plate that has been electrothermally separated. Circuits are printed on both sides of the substrate 20, the circuit is connected to the LED chip 10, the thickness of the substrate 20 is 0.8-2 mm, and a heat-conducting copper plate 30 is arranged on each side of the substrate 20, and the heat-conducting copper plate 30 and the substrate 20 Seamless connection, the fixed heat conduction cylinder 40 is provided with a fixation hole 41 , and the heat conduction copper plate 30 and the base plate 20 are plugged into the fixation hole 41 .

[0025] In this embodiment, the substrate 20 is a metal plate subjected to electrothermal separation, which can isolate current without affecting the thermal conductivity. Circuits are printed on both sid...

Embodiment 2

[0029] Such as figure 1 , 2 , 3, in this embodiment, the heat conduction copper plate 30 is seamlessly connected with the inner wall of the fixing hole 41 . There are 2-8 LED chips 10 , which are fixedly arranged on the left and right sides of the substrate 20 . The thickness of the heat conducting copper plate 30 is 0.4-1.5 mm. A radiator 50 is also included, and the radiator 50 is arranged on the fixed heat conducting tube 40 . The length and width of the substrate 20 are greater than that of the heat-conducting copper plate 30, the substrate 20 extends out of the fixing hole 41, and the heat-conducting copper plate 30 does not extend out of the fixing hole 41. The substrate 20 and the fixed heat conducting cylinder 40 are made of copper.

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PUM

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Abstract

The invention relates to an automobile LED headlamp which comprises a base plate, LED chips arranged on the base plate and a fixed heat conduction barrel; the base plate is a metal plate subjected to electric heating separation treatment; the two side faces of the base plate are printed with circuits, and the circuits are connected with the LED chips; the thickness of the base plate is 0.8-2 mm, the two sides of the base plate are each provided with a heat conduction copper plate, and the heat conduction copper plates are in seamless connection with the base plate; the fixed heat conduction barrel is provided with a fixing hole, and the heat conduction copper plates and the base plate are inserted into the fixing hole. By means of the design manner, the traditional manner of automobiles that two base plates provided with LED chips are assembled back to back is avoided, and the thickness of the base plate can be reduced so that the light pattern generated by the LED chips can be close to that of a traditional halogen lamp.

Description

[0001] 【Technical field】 [0002] The invention relates to an LED vehicle lamp, in particular to an automobile headlamp. [0003] 【Background technique】 [0004] Traditional automotive LED headlights use two substrates equipped with LED chips 10 to be assembled back-to-back in order to achieve 360° light emission. However, the substrate itself needs to have a certain thickness to ensure stable structure and good heat dissipation, and this thickness At least more than 2 mm, so the blind area of ​​the car LED headlight will be very large due to the blocking of the substrate, which cannot meet the user's requirements. Moreover, screws are used to fasten the substrate and the substrate. This method requires the fastening force provided by the screw to be large. Otherwise, the LED chip will be separated from the substrate due to vibration, which will cause the LED chip to burn out or shorten its life. To increase the fastening force of the screw, it is necessary to increase the bac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S8/10F21V29/71F21V29/89F21V19/00F21W101/10F21Y115/10
CPCF21S41/141F21V19/001F21V29/71F21V29/89F21W2102/00
Inventor 潘光智
Owner GUANGZHOU RIXIONG ELECTRONICS TECH CO LTD
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