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Device and method for monitoring target material consumption condition

A target and condition technology, applied in metal material coating process, ion implantation plating, coating, etc., can solve the problem that the target cannot be found in time, so as to avoid the problem of target breakdown, improve product yield, The effect of improving target utilization efficiency

Active Publication Date: 2017-08-11
WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the defect that the consumption of the target cannot be found in time, and to invent a device for monitoring the consumption of the target that can grasp the consumption of the target in time

Method used

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  • Device and method for monitoring target material consumption condition
  • Device and method for monitoring target material consumption condition
  • Device and method for monitoring target material consumption condition

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Experimental program
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Embodiment Construction

[0027] The present invention will be further described below in conjunction with accompanying drawing.

[0028] Such as figure 1 and figure 2 As shown, it is a top view of the device for monitoring target consumption status and a cross-sectional view of the device for monitoring target consumption status of the present invention, respectively: it includes: a target back plate 1 and a target material 2, and the target material is adhered by an adhesive layer 3 connected to the target back plate 1. A loop component (drawn in the figure), when the target is not consumed to a specified level, the loop component can form a complete loop with the target, when the target is consumed to a specified level, the The loop assembly cannot form a complete loop with the target. With such an arrangement, it is possible to detect the degree of target material consumption in time when the circuit cannot be formed, and it is convenient to replace the target material.

[0029] Wherein, the l...

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PUM

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Abstract

The invention discloses a device for monitoring the target material consumption condition. The device for monitoring the target material consumption condition comprises a target material back plate, a target material and a loop assembly. The target material is bonded to the target material back plate through a bonding layer. When the target material is not consumed to the assigned degree, an integral loop can be formed by the loop assembly and the target material. When the target material is consumed to the assigned degree, the loop assembly cannot form the integral loop with the target material. The target material consumption condition can be monitored in real time, the target material is utilized to the maximum degree, the problem of target material puncturing is solved, and the product yield and the target material using efficiency are improved.

Description

technical field [0001] The invention is a device and method for monitoring target material consumption applied to the field of physical sputtering film formation. Background technique [0002] In the process of manufacturing thin film transistor substrates, metal films such as aluminum, molybdenum, titanium, and copper, and non-metallic films such as semiconductor transparent conductive films and IGZO need to be deposited on glass substrates. This process is usually completed by physical vapor deposition (PVD); The working principle of the meteorological deposition machine is to use the argon ions in the plasma to bombard the target, sputter out the target atoms, and transfer them to the surface of the glass substrate to complete the deposition of the film layer; the machine is installed according to the needs of the deposited film layer. The target material is continuously consumed with the prolongation of the use time. At present, the target material consumption on the mac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/54C23C14/34
CPCC23C14/34C23C14/54
Inventor 刘思洋
Owner WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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