Polishing solution online mixing and internal supply polishing machine tool
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JILIN UNIV
- Publication Date
- 2017-08-18
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Abstract
Description
technical field
[0001] The invention relates to the field of chemical mechanical polishing, in particular to an online preparation and internal supply type polishing device for polishing liquid. Background technique
[0002] Chemical mechanical polishing (CMP) is to remove the material on the surface of the workpiece by means of the mechanical removal and chemical action of abrasives under the action of chemical reagents and polishing pressure, so as to obtain an optical precision surface.
[0003] Polishing liquid is one of the key elements of CMP, and the polishing liquid of CMP generally contains H 2 o 2 Therefore, factors such as the concentration stability of the chemical components of the polishing liquid, the amount of liquid applied, the speed of liquid applied, the pH value, and the temperature all affect the polishing removal rate. Especially when performing iterative correction polishing on the surface of large optical components, the instability of removal rate...