Polishing solution online mixing and internal supply polishing machine tool

Abstract

The invention relates to a polishing solution online mixing and internal supply polishing machine tool, belonging to the field of chemical mechanical polishing. A polishing solution recycling bin and a machine tool support are fixedly connected with a machine tool base, and a polishing solution online mixing device is fixedly connected with the upper part of the polishing solution recycling bin. A Z-direction feeding mechanism is fixedly connected with the machine tool support and is connected with an A-axis swing mechanism, and the A-axis swing mechanism is connected with a polishing head tool system. An X-direction feeding mechanism is fixedly connected with the machine tool base, and the upper part of the X-direction feeding mechanism is connected with a Y-direction feeding mechanism. The upper part of the Y-direction feeding mechanism is connected with a C-axis rotary table. The polishing solution online mixing and internal supply polishing machine tool has an important academic value and greater social and economic benefits for improving the manufacturing level and manufacturing capacity of high-quality optical elements in China, advancing the theoretical innovation of precision manufacturing of an optical curved surface, and accelerating the rapid development of aerospace, machinery manufacturing and other industries in China.

Description

technical field [0001] The invention relates to the field of chemical mechanical polishing, in particular to an online preparation and internal supply type polishing device for polishing liquid. Background technique [0002] Chemical mechanical polishing (CMP) is to remove the material on the surface of the workpiece by means of the mechanical removal and chemical action of abrasives under the action of chemical reagents and polishing pressure, so as to obtain an optical precision surface. [0003] Polishing liquid is one of the key elements of CMP, and the polishing liquid of CMP generally contains H 2 o 2 Therefore, factors such as the concentration stability of the chemical components of the polishing liquid, the amount of liquid applied, the speed of liquid applied, the pH value, and the temperature all affect the polishing removal rate. Especially when performing iterative correction polishing on the surface of large optical components, the instability of removal rate...

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Problems solved by technology

[0004] The invention provides a polishing liquid that is prepared online and supplied to a polishing machine tool to solve the problem that the components of the polishing liquid cannot be kept stable during the polishing process

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