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Integrated box-packaged FD metal oxide varistors (FDMOV) composite assembly with air discharging structure

An air discharge, composite component technology, applied in the direction of varistor core, resistor shell/packaging shell/potting, varistor, etc., can solve the problem that conventional MOV cannot meet the actual needs, and achieve large economical use Value, no leakage current, low cost effect

Active Publication Date: 2017-08-18
LONGKE ELECTRONICS HUIYANG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the rapid development of clean energy technology, the popularity of high-speed rail and the wide application of electronic machinery (such as robots, manipulators, etc.), the leakage current generated by conventional MOVs in applications has also affected some application fields, such as railway track signals. It must be protected, and leakage current is not allowed during normal operation. Due to the high environment, high reliability, and performance requirements of disposable products (such as 5G communication), conventional MOVs cannot meet actual needs and need further improvement.

Method used

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  • Integrated box-packaged FD metal oxide varistors (FDMOV) composite assembly with air discharging structure
  • Integrated box-packaged FD metal oxide varistors (FDMOV) composite assembly with air discharging structure
  • Integrated box-packaged FD metal oxide varistors (FDMOV) composite assembly with air discharging structure

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Experimental program
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Effect test

Embodiment 1

[0031] Such as figure 1 with figure 2 As shown, this embodiment provides a box-packed FDMOV composite assembly, including a box body 1, an insulating fixing plate 2, an upper discharge electrode 3, an insulating ring piece 4, a lower discharge electrode 5, an MOV chip 6, a lead-out electrode piece 7 and screws 8.

[0032] Four corners of the bottom of the box body 1 are provided with four screw holes 9, and the insulating fixing plate 2 is rectangular, and four through holes 10 are arranged at the four corners.

[0033] The upper discharge electrode 3 is circular and is provided with an upper discharge electrode lead-out pin 31 .

[0034] The insulating ring sheet 4 is annular, and its shape is directly larger than the diameter of the MOV chip 6 by 1-5mm.

[0035] The lower discharge electrode 5 is circular.

[0036] The MOV chip 6 is coated with compound electrodes on the surface.

[0037] The lead-out electrode sheet 7 is a metal rectangle, with through holes 10 provid...

Embodiment 2

[0046] Such as Figure 2a As shown, the difference between this embodiment and Embodiment 1 is that a single double-layer box body 1 is adopted, an insulating fixing plate 2 is added, a lead-out electrode sheet 7, an MOV chip 6, a lower discharge electrode 5 and an insulating ring sheet 4 are added. Form two series circuits.

[0047] According to the insulating fixed plate 2, lead-out electrode piece 7, MOV chip 6, lower discharge electrode 5, insulating ring piece 4, upper discharge electrode 3, insulating ring piece 4, lower discharge electrode 5, MOV chip 6, lead-out electrode piece 7, insulation The fixing plates 2 are stacked sequentially, put into the first space 101 in the box body 1, 4 screws pass through the insulating fixing plate 2, the 4 through holes 10 on the insulating fixing plate 2 are fastened to the screws in the box body 110 Hole 9, after installation, potting silica gel, epoxy resin, put on box body 1 shell 12.

[0048] In this embodiment, the box body 1...

Embodiment 3

[0055] Such as Figure 3a with 3bAs shown, the present embodiment is a three-group series structure assembled together, which can conveniently form an angular application circuit.

[0056] The difference between this embodiment and embodiment 1 is that the 3 groups formed according to embodiment 1 are connected in series.

[0057] Such as Figure 3a As shown, one group consists of upper discharge electrode 3, insulating ring 4, MOV chip 6, and lead-out electrode 7, and another group consists of upper discharge electrode 3, insulating ring 4, MOV chip 6, and 5 lead-out electrodes. The third group is composed of the upper discharge electrode sheet 3, the insulating ring sheet 4, the MOV chip 6, and the lead electrode sheet 7. The three groups are placed in sequence, and the uppermost and the lowermost are provided with insulating fixing plates 2 and 1, and the whole is put into the box. 1. Fasten according to the above embodiment. After installation, potting silica gel, epox...

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PUM

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Abstract

The invention provides an integrated box-packaged FD metal oxide varistors (FDMOV) composite assembly with an air discharging structure. The integrated box-packaged FDMOV composite assembly comprises a box body, bolts and an FDMOV assembly, wherein the FDMOV assembly is arranged in the box body, the FDMOV assembly and the box body are fixed by the bolts, and the FDMOV assembly comprises at least one of an insulation fixing plate, an upper discharging electrode, an insulation ring sheet, a lower discharging electrode, an MOV chip and a leading-out electrode. The integrated box-packaged FDMOV composite assembly with the air discharging structure is simple and rapid, is suitably mechanical, is low in cost and has great economic application value.

Description

technical field [0001] The invention relates to the technical field of piezoresistor design, in particular to an integrated boxed FDMOV composite assembly with an air discharge structure. Background technique [0002] Conventional MOVs (Metal Oxide Varistors, zinc oxide varistors) have special nonlinear current-voltage characteristics. Once abnormal conditions occur, such as lightning strikes, electromagnetic field interference, frequent power switch actions, and power system failures, etc., the line When the voltage suddenly increases and exceeds the conduction voltage of the varistor, it will enter the conduction region, and the current (I) and voltage (V) have a nonlinear relationship, which is generally called the nonlinearity coefficient (Nonlinearity Parameter), and its value can reach Tens or hundreds, at this time, the impedance of the surge protector (SPD) will become low, only a few ohms, so that the overvoltage forms a surge current to flow out, thereby protecting...

Claims

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Application Information

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IPC IPC(8): H01C7/112H01C1/02H01C1/14
CPCH01C1/02H01C1/14H01C7/112
Inventor 陈泽同曾清隆
Owner LONGKE ELECTRONICS HUIYANG
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