Semiconductor chip with fracture detection

Abstract

The invention relates to a semiconductor chip with fracture detection. The semiconductor chip 100 includes a substrate 101, an integrated circuit 102, an indentation 110 of the substrate 101, a conductor track 121, and also a crossover 111 between the indentation 110 and the conductor track 121. Detection of a test signal fed into the conductor track 121 is made possible in this way. In various examples, a fracture of the substrate 101 in the region of the indentation 110 can be detected.

Description

technical field [0001] Various embodiments relate to a semiconductor chip with a substrate, an integrated circuit, a recess of the substrate, conductor tracks and an intersection between the recess of the substrate and the conductor tracks. A further embodiment relates to a method comprising the detection of a test signal indicative of a break of the substrate of the semiconductor chip at the recess. Background technique [0002] Modern electronic systems use semiconductor chips comprising integrated circuits with defined functions on a substrate. The failure safety of the corresponding electronic systems must meet high requirements in different applications. For example, for automotive applications it may be necessary to meet relatively stringent requirements for failure safety, for example according to standard 26262 of the International Organization for Standardization (ISO). Typically, the failure safety of the respective electronic system is characterized by the react...

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Problems solved by technology

Lack of safety may occur if electronic systems continue to be used despite restricted functionality

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