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Anisotropic Conductive Film

An anisotropic, conductive film technology, used in conductive connections, conductive adhesives, conductors, etc., can solve problems such as short circuits and poor conduction, and achieve short circuit suppression, good conduction reliability, and good initial on-resistance. effect of value

Active Publication Date: 2021-11-23
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, in the case of Patent Document 1, it is difficult to densely fill the entire surface of the stretchable film with conductive particles without defects in a single layer, and there is a problem that conductive particles fill the stretchable film in an aggregated state, causing a short circuit. The reason, or the area that is not filled (that is, "missing"), becomes the cause of poor conduction

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0110] A nickel plate with a thickness of 2 mm was prepared, and cylindrical recesses (inner diameter 3 μm, depth 10 μm) were formed in a square grid pattern to serve as a transfer master. The distance between the centers of adjacent recesses is 8 μm. Therefore, the density of the recesses is 16000 / mm 2 .

[0111] To the obtained transfer body master plate, a dry thickness of 30 mm was applied, containing 60 parts by mass of phenoxy resin (YP-50, Nippon Steel & Sumikin Chemical Co., Ltd.), epoxy resin (jER828, Mitsubishi Chemical Co., Ltd.) 40 parts by mass of a thermosetting resin composition and a cationic curing agent (SI-60L, Sanshin Chemical Industry Co., Ltd.) 2 parts by mass were heated at 80° C. for 5 minutes to prepare a transfer body.

[0112]The transfer body was peeled off from the original disc, wound up on a stainless steel roll with a diameter of 20 cm so that the protrusions were on the outside, and the roll was brought into contact with an adhesive sheet imp...

Embodiment 2

[0117] The anisotropic conductive film was obtained by repeating Example 1 except having made the number of times of blowing for removing the conductive particle which did not adhere to the microadhesion layer triple that of Example 1.

Embodiment 3

[0119] The inner diameter of the concave portion of the transfer master disk is 2 μm, the depth of the concave portion is 9 μm, the distance between the centers of adjacent concave portions is 6 μm, and the density of the concave portion is 28,000 pieces / mm 2 , and instead of the conductive particles with an average particle diameter of 4 μm, except that conductive particles with an average particle diameter of 3 μm (AUL703, Sekisui Chemical Co., Ltd.) were used, Example 1 was repeated to obtain an anisotropic conductive film.

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Abstract

The present invention provides an anisotropic conductive film, which is laminated with an insulating adhesive base layer and an insulating adhesive cover layer, and has a structure in which conductive particles are arranged at lattice points of a planar lattice pattern in the vicinity of the interface. In all grid points of the planar lattice pattern assumed in an arbitrary reference area, the ratio of the grid points where no conductive particles are arranged is 25% or less, and a part of the conductive particles arranged at the grid points of the planar grid pattern are in each direction relative to the corresponding grid points. The lengthwise direction of the heteroconductive film is offset, and the offset defined as the distance between the planar projection center of the offset conductive particles and the corresponding grid point is less than 50% of the average particle diameter of the conductive particles.

Description

technical field [0001] The present invention relates to anisotropic conductive films. Background technique [0002] When electrical components such as IC chips are mounted on wiring boards, etc., anisotropic conductive films in which conductive particles are dispersed in insulating resin binders are widely used, but for such anisotropic conductive films, conductive particles Exist in a state of being connected or cohesive with each other. Therefore, when the anisotropic conductive film is used for connection between the terminals of the IC chip and the terminals of the wiring board, which are finer in pitch along with the weight reduction and miniaturization of electronic equipment, since the anisotropic conductive film contains Conductive particles existing in a connected or aggregated state may cause a short circuit between adjacent terminals. [0003] Conventionally, anisotropic conductive films in which conductive particles are regularly arranged in the film have been ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R11/01H01B5/16H01B13/00H01L21/60C09J7/10
CPCC08K9/02H01L24/29C08K2201/001C09J2203/326C09J2433/00C09J2463/00C09J7/10H01L2224/2939H01L2224/29455H01L24/27H01L24/32H01L2224/13144H01L2224/2929H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29355H01L2224/29364H01L2224/32225H01L2224/83203H01L2224/83851H01L2924/14H01L2224/27003H01L23/49827C09J9/02H01B1/12H01B1/20C09J2301/208C09J2301/302C09J2301/408H01B5/16H01B13/0026H01B13/0036H01R11/01C09J2499/00
Inventor 筱原诚一郎
Owner DEXERIALS CORP