Processing apparatus
A technology for processing devices and components, applied in metal processing equipment, manufacturing tools, laser welding equipment, etc., can solve the problems of complex processing equipment and reduced processing efficiency, and achieve the effect of achieving processing efficiency and excellent bending strength.
Inactive Publication Date: 2017-08-22
DISCO CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
), in order to divide by plasma etching along the planned dividing line, it is necessary to cover the front surface of the wafer with a resist film and expose the planned dividing line to remove it, and there is a problem that the processing equipment is complicated and the processing efficiency is reduced.
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Embodiment Construction
[0018] Hereinafter, preferred embodiments of the processing apparatus according to the present invention will be described in more detail with reference to the drawings.
[0019] exist figure 1 The processing device provided by the present invention is shown in , and for the convenience of description, the cavity 7 that constitutes a part of the processing device 1 and covers the upper part of the holding member on the stationary base 2 is shown separately.
[0020] figure 1 The shown laser processing device 1 has: a stationary base 2; a holding table mechanism 3 as a holding member configured to be movable in an X-axis direction shown by an arrow X and in a Y-axis direction shown by an arrow Y. It is provided on the stationary base 2 and holds a workpiece; and a laser beam irradiation unit 4 is provided on the stationary base 2 and has a laser beam irradiation member 5 .
[0021] The table holding mechanism 3 has: a pair of guide rails 31, 31 arranged in parallel on the sta...
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Abstract
The invention provides a processing apparatus capable of efficiently performing processing without reducing the bending strength of each divided devices without complicating a processing apparatus. According to the invention, provided is a processing apparatus, at least comprising a holding member having a holding surface for holding a wafer, a cavity which holds the holding member and is opposed to the holding surface to form a translucent shielding window, a laser beam irradiating member for irradiating laser on the wafer held by the holding member by the translucent shielding window; a moving member for moving the laser light irradiated from the laser beam irradiating member relative to the holding member, and an etching gas supply member that provides an etching gas to the cavity, to etch a dividing predetermined line excited by irradiation of laser light; and a discharge member that discharges the etching gas from the cavity.
Description
technical field [0001] The present invention relates to a processing device that irradiates laser beams on the front surface of a wafer to etch planned dividing lines. Background technique [0002] With regard to a wafer divided by a planned dividing line and formed with a plurality of devices such as ICs and LSIs on the front surface, the planned dividing line is ablated by a dicing device that has a rotatable cutting tool that cuts the planned dividing line Laser processing equipment or the like for processing or internal processing and dividing along planned dividing lines divides the wafer into individual devices and applies them to electronic devices such as mobile phones and personal computers. [0003] However, it is known that in the processing performed by the above-mentioned scribing apparatus and laser processing apparatus, distortion occurs on the periphery of each divided device, and since the distortion caused by the processing remains on the periphery of the d...
Claims
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IPC IPC(8): B23K26/362
CPCB23K26/361B23K2103/56H01L21/268H01L21/3065H01L21/32136H01L21/67069H01L21/76H01L21/78
Inventor 能丸圭司
Owner DISCO CORP