Antenna heat-dissipating integrated transceiver structure and manufacturing method

Abstract

The invention belongs to the technical field of heat radiation of electronic equipment and provides an antenna heat-dissipating integrated transceiver structure and a manufacturing method in view of problems in the prior art in order to solve heat dissipation and integration problems in the receiver miniaturization integrated design and to improve the heat dissipation capability and the reliability of the antenna heat-dissipating integrated transceiver. A through slot is disposed at a position corresponding to a heat dissipation chip on a PCB substrate. An antenna heat-dissipating integrated unit having a metal boss is produced and the metal boss passes through the through slot. The space between the PCB substrate and the antenna heat-dissipating integrated unit is filled with a heat-dissipating material with high thermal conductivity. The PCB substrate and the antenna heat-dissipating integrated unit are subjected to press fit by high-temperature press fit. The space between metal boss and the heat dissipation chip is filled with the heat-dissipating material with high thermal conductivity. The heat dissipation chip is connected with the PCB substrate via a wire.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic equipment, in particular to a structure and a manufacturing method of an antenna heat dissipation integrated transceiver. Background technique [0002] At present, there are mainly two methods for heat dissipation of high power density chips (high power radio frequency chips) on PCB circuit boards. One is to make heat dissipation through holes on the PCB, and use the through holes to conduct heat from the high-power RF chip to the metal cavity on the back of the PCB; the other is to embed copper blocks inside the PCB, and use the through holes to The copper block conducts the heat of the high-power RF chip to the metal cavity on the back of the PCB. [0003] The use of through-hole heat dissipation mainly has the following two disadvantages: 1. Low thermal conductivity. Generally, the heat dissipation through-hole is filled with resin. The thermal conductivity of the resin ...

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Problems solved by technology

[0003] The use of through-hole heat dissipation mainly has the following two disadvantages: 1. Low thermal conductivity. Generally, the heat dissipation through-hole is filled with resin. The thermal conductivity of the resin material is low, and the metal with high thermal conductivity is only around the through-hole. For the chip mounting area The thermal conductivity is not greatly improved; 2. The thermal resistance is large and the heat conduction path is long - the heat o

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