Preparation method of epoxy resin system for prepregs, and prepreg preparation method
A technology of epoxy resin system and epoxy resin matrix, which is applied in the preparation of epoxy resin system for prepreg and the field of prepreg preparation
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
preparation example Construction
[0032] A preparation method for epoxy resin system in prepreg, comprising the following steps:
[0033] S110, stirring the epoxy resin matrix at 50° C. to 100° C. to form component A.
[0034] Wherein, the epoxy resin matrix is selected from at least one of bisphenol A glycidyl ether, novolac epoxy resin and glycidylamine epoxy resin.
[0035] Specifically, the epoxy resin matrix is stirred at 50° C. to 100° C. to form a uniform and stable component A.
[0036] S120, mixing the room temperature reactive curing agent and the latent curing agent to form component B.
[0037] Wherein, the room temperature reactive curing agent is selected from at least one of aliphatic amines and alicyclic amines.
[0038] The latent curing agent is selected from at least one of dicyandiamide, modified dicyandiamide, urea derivatives, diaminodiphenyl sulfone, boron trifluoride monoethylamine and imidazole curing agents.
[0039] S130, mixing and reacting the above component A and component...
Embodiment 1
[0059] (1) Preparation of epoxy resin system for prepreg
[0060] Part A was formed by stirring epoxy novolac resin and liquid bisphenol A type epoxy resin at 50°C. The aliphatic amine and dicyandiamide are mixed to form component B. Component A and component B were mixed and reacted at a mass ratio of 100:20 to obtain an epoxy resin system for prepreg, and the initial viscosity of the epoxy resin system for prepreg was 5000cps.
[0061] (2) Preparation of prepreg
[0062] The above prepregs were prepared into adhesive films with epoxy resin system. Composite the above adhesive film with reinforcing fibers to obtain a prepreg. The resin penetration rate of the prepreg is 30%, and the areal density of the prepreg is 50g / m 2 , the resin fluidity of the prepreg is 16%.
[0063] The above epoxy resin system for prepreg was placed at 25° C. for 7 days, and the viscosity of the epoxy resin system for prepreg was measured to be 15000 cps.
[0064] The above prepreg was placed a...
Embodiment 2
[0066] (1) Preparation of epoxy resin system for prepreg
[0067] The solid bisphenol A type epoxy resin and the liquid bisphenol A type epoxy resin were stirred at 100°C to form Component A. The cycloaliphatic amine and modified dicyandiamide are mixed to form component B. Component A and component B were mixed and reacted at a mass ratio of 100:13 to obtain an epoxy resin system for prepreg, and the initial viscosity of the epoxy resin system for prepreg was 10200cps.
[0068] (2) Preparation of prepreg
[0069] The above prepregs were prepared into adhesive films with epoxy resin system. Composite the above adhesive film with reinforcing fibers to obtain a prepreg. The resin penetration rate of the prepreg is 50%, and the areal density of the prepreg is 500g / m 2 , the resin fluidity of the prepreg is 14%.
[0070] The above epoxy resin system for prepreg was placed at 25° C. for 7 days, and the viscosity of the epoxy resin system for prepreg was measured to be 20000 cp...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com