Fastening components with low wind pressure loss, heat dissipation components and combined structure with chipset

Abstract

The invention discloses a low-wind-pressure-loss buckling component, a heat radiation component and a combination structure of the heat radiation component and a chip set. The heat radiation component comprises a heat radiator and the buckling component. The heat radiator comprises a baseplate and multiple heat radiating bodies. The buckling component comprises a rectangular frame, multiple first side plates and multiple flow guide plates. The rectangular frame comprises two first beam bodies, two second beam bodies, a first surface and a second surface, and the first beam bodies and the second beam bodies are defined in a connection way to form a hollow area so that multiple heat radiating bodies are enabled to be arranged in the hollow area in a penetration way. The multiple first side plates extend out of the two first beam bodies of the rectangular frame. The multiple flow guide plates extend out of the second beam bodies of the rectangular frame.

Description

technical field [0001] The present invention relates to a combined structure of a heat dissipation component and a chipset, a heat dissipation component and a fastening component thereof, in particular to a fastening component which can make the wind field passing through the radiator more concentrated and uniform, and a suitable heat dissipation component and Combination structure of cooling components and chipset. Background technique [0002] As the performance of electronic devices continues to improve, the waste heat generated by the chipset inside the electronic device also increases accordingly. Since the operating temperature of the chipset has a great impact on its working efficiency, how to efficiently use the chipset It is an important issue to keep the operating temperature of the chipset within an ideal range to dissipate the generated waste heat. [0003] The heat dissipation method in the prior art is to attach a heat sink with high thermal conductivity to th...

AI Technical Summary

Problems solved by technology

[0009] Yet another object of the present invention is to provide a combination structure of a fastening assembly, a heat dissipation assembly, and a heat dissipation assembly and a chip set. The air deflector on the upper part is used to solve the problem that the airflow flowing through the heat sink is scattered and the wind field is uneven when the bottom plate of the heat sink is enlarged, and the overall heat dissipation efficiency of the heat dissipation component is further improved

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