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Method for molding conductor, and conductor

A molding method and conductor technology, applied in electrical components, electrical digital data processing, magnetic field/electric field shielding, etc., can solve the problems of conductive film and support deformation, shape error, complex manufacturing, adhesive fusion adhesion, etc. , to achieve the effect of preventing peeling

Active Publication Date: 2017-08-29
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When manufacturing a touch panel with such a three-dimensional shape, there is a method of bonding the conductive film and the support to each other after deforming them into a three-dimensional shape together. When the position deviates, it is difficult to obtain a high-quality touch panel, and it causes the manufacturing to become complicated
[0005] In addition, there is also a method of manufacturing a three-dimensional touch panel by placing a conductive film in a mold and performing injection molding to form a support, but it is difficult to form a thin support in injection molding.
[0006] Then, for example, in Patent Document 1, a method of bonding the conductive film to a flat support and then integrally molding the conductive film and the support into a three-dimensional conductor has been studied. Parts with large deformation, especially in high-temperature and high-humidity environments, the adhesive is melted and the adhesive force is reduced, and the conductive film is peeled off from the support

Method used

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  • Method for molding conductor, and conductor
  • Method for molding conductor, and conductor
  • Method for molding conductor, and conductor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0046] figure 1 The structure of the laminated body 1 used for the molding method of the conductor of Embodiment 1 is shown in . This laminated body 1 is used to manufacture a rectangular tube-shaped (box-shaped) touch panel by performing three-dimensional processing including bending processing, and the transparent conductive film 3 is bonded to a transparent insulating film having a flat plate shape through a transparent adhesive 4 . on the surface of the support 2. In the conductive film 3 , conductive members 32 are respectively formed on both surfaces of a flexible transparent insulating substrate 31 , and transparent protective layers 33 are formed on both surfaces of the insulating substrate 31 so as to cover the conductive members 32 .

[0047] Such as figure 2 As shown, a sensing area S1 is defined on the conductive film 3 , and a peripheral area S2 is defined outside the sensing area S1 . On the surface of the insulating substrate 31, a plurality of first detect...

Embodiment approach 2

[0112] In the first embodiment described above, the heater 5 was disposed near the portion C of the laminated body 1 to be the curved portion 6 by processing and at a position facing the conductive film 3 of the laminated body 1, but the present invention is not limited thereto. Such as Figure 6 As shown, the heater 5 can also be arranged in the vicinity of the portion C serving as the curved surface portion 6 of the laminated body 1 and at a position facing the support body 2 of the laminated body 1 .

[0113] By the heat from the heater 5, the material constituting the support body 2 in the portion C that becomes the curved surface portion 6 is heated to a temperature higher than the glass transition temperature, so the heater 5 is arranged at a position facing the support body 2, That is, when the curved surface 6 is formed, the curved surface 6 can be produced efficiently by arranging it at a position outside the curved surface 6 .

[0114] In addition, in Embodiments 1 ...

Embodiment 1

[0122] Tensile force is applied to the laminated body 1 in which the transparent conductive film 3 is bonded to the surface of the support body 2 through the transparent adhesive agent 4, and while only the portion to be the curved surface 6 is heated, the support body 2 becomes Bending is performed so that the outer side and the conductive film 3 are on the inner side, thereby producing the curved surface portion 6 .

[0123] Using polycarbonate (PC) with a thickness of A1 = 0.5 mm as the support body 2, a transparent conductive material with a thickness of B1 = 0.1 mm having an insulating substrate 31 comprising biaxially stretched polyethylene terephthalate (PET) is used. Film As the conductive film 3 , an optically transparent adhesive sheet (OCA) 8172CL manufactured by 3M Co., Ltd. having a thickness of C1 = 0.05 mm was used as the adhesive 4 .

[0124] In addition, the heating temperature of the portion C to be the curved surface 6 is set to 160° C., the radius of curvat...

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Abstract

The invention discloses a method for molding a conductor, and a conductor. Provided are a method for molding a conductor, whereby separation of a support and an electroconductive film can be prevented even when a curved-face section having a small curvature radius is formed, and a conductor. A curved-face section 6 of a conductor 1 is fabricated by heating only a portion C forming the curved-face section 6 through use of a heater 5, and subjecting the conductor 1 to bending so that a support 2 is on the outside and the electroconductive film 3 is on the inside while applying a tensile force F to the conductor 1, and the ratio A2 / A1 of the thickness A2 of the support 2 in the curved-face section 6 to the thickness A1 of the support 2 in a flat section P is at least a minimum value of (R + B1 / 2) / ((R+ B1 + C1 + A2 / 2) X 1.45) and no more than a maximum value of (R + B1 / 2) / ((R + B1 + C1 + A2 / 2) X 0.9), where B1 is the thickness of the electroconductive film 3, C1 is the thickness of an adhesive 4, and R is the curvature radius of the inside face of the electroconductive film 3 in the curved-face section 6.

Description

technical field [0001] The invention relates to a forming method of a conductor, in particular to a forming method for obtaining a three-dimensional conductor. Furthermore, the present invention also relates to a three-dimensional conductor. Background technique [0002] In recent years, in various electronic devices including portable information devices, touch panels are being used in combination with display devices such as liquid crystal displays, and input operations to electronic devices are performed by touching the screen. . [0003] In addition, in the pursuit of improving the portability and operability of electronic equipment, touch panels that are thin and capable of handling three-dimensional shapes are required, and detection electrodes formed on flexible and transparent insulating substrates are advancing. development of conductive films. [0004] When manufacturing a touch panel with such a three-dimensional shape, there is a method of bonding the conducti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C53/04G06F3/041H05K9/00
CPCB29C53/04G06F3/041H05K9/00
Inventor 宫本治彦
Owner FUJIFILM CORP