Lapping and polishing tool and polishing machine

Abstract

The invention provides a lapping and polishing tool and a polishing machine, and relates to the technical field of computer control optical surface formation. The lapping and polishing tool is used for being mounted on the polishing machine; the polishing machine comprises a polishing machine body; the lapping and polishing tool comprises a polishing component and a polishing mold layer; the polishing component comprises a flow guide part; the polishing mold layer is connected with one side of the flow guide part; the other side of the flow guide part is used for being connected with the polishing machine body; the flow guide part is provided with a fluid channel; the polishing mold layer is provided with a liquid outlet channel; one end of the fluid channel communicates with the liquid outlet channel; and the other end of the fluid channel penetrates through the flow guide part. The lapping and polishing tool has the benefits as follows: the distribution uniformity of a polishing solution is effectively controlled, the polishing solution is enabled to permeate into the bottom of the polishing tool, the polishing efficiency is improved, lot of heat in the central area at the bottom of the lapping and polishing tool is carried away, the element surface is stably polished, and the element surface figure accuracy is high; as the polishing machine provided by the invention adopts the lapping and polishing tool, the polishing efficiency is further improved, the element surface is stably polished, and the element surface figure accuracy is high.

Description

technical field [0001] The invention relates to the technical field of computer-controlled optical surface shaping, in particular to a polishing tool and a polishing machine. Background technique [0002] Computer Controlled Optical Surfacing (CCOS) is an optical processing technology developed in the 1970s. Compared with traditional processing technology, it greatly reduces the dependence on operator experience. The core idea of ​​this technology is to use a computer to control a small-sized processing tool (or polishing tool) that is much smaller than the workpiece to be processed, to polish the surface of the workpiece with a certain trajectory, speed and pressure, and to control the relative movement between the tool and the workpiece. The speed, pressure and the residence time of the tool on a certain area of ​​the surface are used to control the amount of material removal, so that the surface error of the part can be quickly converged. In the CCOS process, the polishi...

AI Technical Summary

Problems solved by technology

This will lead to less polishing particles actually participating in the polishing, thereby reducing the polishing efficiency

Moreover, since it is difficult for the polishing liquid to enter the center area of ​​the bottom of the polishing tool, the heat generated by the friction between the polishing tool and the components cannot be taken away, resulting in an increase in the temperature of the center area of ​​the bottom of the polishing tool and accelerated wear, which in turn affects the removal stability and Component Surface Accuracy

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