A kind of microelectromechanical system and preparation method thereof

Abstract

The invention discloses a micro electro mechanical system and preparation method thereof and a preparation method thereof, solving the problem that in the prior art, a lead between a micro electro mechanical device unit and an integrated circuit is relatively long, and thus too many interference signals are introduced. The method comprises the steps of preparing a first packaging ring surrounding a gas sensitive unit on a micro electro mechanical device chip and a first electrical connection point positioned around a gas sensitive unit on the inner side of the first packaging ring; preparing a second package ring and a second electrical connection point serving as an input end of a circuit layer at positions corresponding to the first packaging ring and the first electrical connection point on an integrated circuit chip; placing the micro electro mechanical device chip and the integrated circuit chip oppositely, wherein the first electrical connection point and the second electrical connection point form an electrical connection, and the first packaging ring and the second packaging ring form a hermetical connection; and forming an air through hole in the micro electro mechanical device chip for a space formed by the micro electro mechanical device chip, the integrated circuit chip, the first packaging ring and the second packaging ring.

Description

Technical field [0001] The invention relates to the field of micro-electromechanical technology, in particular to a microelectromechanical system and a preparation method thereof. Background technique [0002] Micro-electromechanical MEMS technology refers to the use of advanced semiconductor manufacturing technology to make a traditional electronic device into a chip containing the corresponding functional unit of the electronic device (ie MEMS device chip). Compared with electronic devices made by traditional technology, MEMS device chips have obvious advantages in terms of volume, power consumption, weight, and price, and can be mass-produced. [0003] Generally, MEMS device chips need to be connected with integrated circuits such as driving, detection, and signal processing to form a system with complete and independent functions, namely MEMS systems. For example, MEMS systems currently available on the market include pressure sensors, accelerometers, and silicon microphones. ...

AI Technical Summary

Problems solved by technology

[0010] In view of this, the embodiment of the present invention provides a micro-electro-mechanical system and its preparation method, which solves the problem in the prior art that the leads between the MEMS device chip and the integrated circuit chip are relatively long, thereby introducing more interference signals

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