Fully automatic chip stripping machine and working method thereof

Abstract

The invention discloses a fully automatic chip stripping machine. The stripping machine comprises a groove type material box loading mechanism, a boundary material stripping mechanism, a chip stripping mechanism, a hollow disc collection mechanism and a film disc multi-station moving and turning mechanism, which are arranged on the same platform. The groove type material box loading mechanism, the boundary material stripping mechanism, the chip stripping mechanism and the hollow disc collection mechanism are successively arranged on the same side with the film disc multi-position moving and turning mechanism side by side. The invention also discloses a working method of the fully automatic chip stripping machine. According to the invention, the fully automatic chip stripping machine is suitable for stripping chips with big areas and thin thicknesses and capable of cleaning boundary materials of chips, stripping the chips, preventing chips from being scratched or damaged and effectively protecting the chips, so working efficiency is greatly improved.

Description

technical field [0001] The invention relates to a stripping machine, in particular to an automatic chip stripping machine and a working method thereof. Background technique [0002] Radio Frequency Identification (RFID) technology is a non-contact automatic identification technology that identifies target objects and obtains relevant data through radio frequency signals. Compared with bar code technology, radio frequency identification technology has many advantages such as waterproof, antimagnetic, high temperature resistance, long service life, large recognition distance, data on the label can be encrypted, storage data capacity is larger, and storage information can be changed, so it is the most promising in the future. One of the most promising information technologies. [0003] The radio frequency identification label packaging equipment is composed of a substrate conveying module, a detection module, a dispensing module, a placement module and a thermal pressing modul...

AI Technical Summary

Problems solved by technology

Unreasonable thimble stripping design and motion planning may lead to direct fragmentation and failure of the chip, directly affecting the pass rate of the product

For example, the patent number is 201310165723.2, which is an invention of an IC chip safety peeling device, which uses thimbles to peel off chips. The top pin in the patent patent produces concentrated stress on the chip. For a chip with a large area and a thin thickness, the chip is prone to fragmentation and damage to the chip.

The patent application number is 201510127933.1, the name is peeling device and the method of peeling off the surface cover layer of the chip package by using the device. The chip is peeled off by setting a vacuum nozzle head in the peeling device. low enough to be widely used

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