Press-fitting device and press-fitting method for a semiconductor device

Abstract

The invention provides a press-fit device for a semiconductor device. The press-fit device comprises a top pressing assembly, a plurality of radiators and two sets of insulation support plates. The two sets of insulation support plates are arranged oppositely in parallel; the plurality of radiators are horizontally supported between the two sets of insulation support plates; and the radiator arranged at the bottom is fixed on the insulation support plate by fastening elements. The top pressing assembly is arranged between the two sets of insulation support plates and applies forces to the radiator at the top layer. The press-fit device has advantages of simple operation, high press-fit reliability, small size, and light weight.

Description

technical field [0001] The invention relates to the field of semiconductor device assembly, in particular to a press-fit device and a press-fit method for semiconductor devices. Background technique [0002] In the field of power electronics, the combined application of semiconductor devices is a common way of semiconductor device applications. In combined applications, it is necessary to use a press-fitting device for semiconductor devices to achieve pressurization of semiconductor devices. [0003] Existing press-fitting devices for semiconductor devices mainly include radiators, semiconductor devices, force-applying components (including screw rods, insulating sleeves), force-transmitting components (including transmission pads, steel balls and disc springs), pressing plates (including upper and lower pressure plate), insulating pads (including upper and lower insulating pads) and connecting copper bars (including upper and lower connecting copper bars). The press-fitti...

AI Technical Summary

Problems solved by technology

[0004] (1) Complex operation and inconvenient maintenance

The force application part adopts the frame structure of screw and pressure plate. During the press-fit operation, 8 or even 16 nuts need to be tightened to realize the frame structure assembly and pressure application. At the same time, tooling or manual measurement is required before press-fit application To maintain the same plane of the radiator, adjust the spacing and parallelism of the upper and lower pressure plates, the operation is complicated; and the gravity of the radiator and the semiconductor device is superimposed, which is not conducive to the replacement of damaged semiconductor devices, resulting in inconvenient maintenance

[0005] (2) Low reliability of press fitting

The pressure on the upper platen is given by the tightening force of the four nuts above the upper platen, and the pressure is transmitted to the device through the force transmission structure to meet the requirements of its press-fitting. Since the force applied by the wrench to each nut is difficult to keep consistent, it is easy to cause The applied force transmitted to the device is uneven, which affects the reliability of press-fitting

[0006] (3) Large weight and volume, high cost

The existing press-fitting devices are basically made of metal parts (steel and aluminum alloy), and the upper and lower insulating pads and insulating sleeves are used to isolate the voltage, and the weight of the components is large; at the same time, in order to complete the installation of the screw, the upper and lower pressing plates The size needs to be larger than the size of the heat sink, resulting in a large component size and complex structure

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