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Viscosity-controllable thermal conductive interface material as well as preparation method and application thereof

An interface material and viscous technology, applied in heat exchange materials, chemical instruments and methods, modification by conduction heat transfer, etc., can solve problems such as reducing thermal conductivity of materials, and achieve good material compression performance, small thermal resistance, and preparation. Simple and easy method

Inactive Publication Date: 2017-09-26
TIANJIN LAIRD TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, more surface coating layers will reduce the thermal conductivity of the material, especially for ultra-thin thermal interface materials with a thickness of less than 10mil

Method used

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  • Viscosity-controllable thermal conductive interface material as well as preparation method and application thereof
  • Viscosity-controllable thermal conductive interface material as well as preparation method and application thereof
  • Viscosity-controllable thermal conductive interface material as well as preparation method and application thereof

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Embodiment 1

[0042] This embodiment provides a method for preparing a thermally conductive interface material with controllable viscosity, which includes the following steps:

[0043] Mix the silicone resin and micron-sized heat-conducting powder spherical alumina at a mass ratio of 10:90, and mix thoroughly to obtain the body glue material;

[0044] Mix silicone resin and nano-scale heat-conducting powder flake-shaped boron nitride in a mass ratio of 95:5 to form a surface coating raw material;

[0045] Coat the raw material glue of the surface coating on the surface of the thermal interface material body glue, and then form a film at room temperature, and then cure it at 120°C for 25 minutes to form a tightly bonded surface coating 3 and heat conduction body layer 2 , to obtain a thermally conductive interface material 1 with controllable viscosity, its structure is as follows figure 1 shown.

[0046] Among them, the scanning electron microscope image of spherical alumina is shown in ...

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Abstract

The invention provides a viscosity-controllable thermal conductive interface material as well as a preparation method and application thereof. The viscosity-controllable thermal conductive interface material comprises a thermal conductive body layer and a surface coating which are tightly bonded, wherein the thermal conductive body layer is formed by mixing organic silicon resin with micro-sized thermal conductive powder according to the mass ratio being (5 to 95) to (40 to 60); the surface coating is formed by mixing the organic silicon resin with nano-scale thermal conductive powder according to the mass ratio being (60 to 40) to (99.99 to 0.01). The viscosity-controllable thermal conductive interface material has the advantages of good material compressing property and thermal conducting property, low thermal resistance and low preparation cost.

Description

technical field [0001] The invention belongs to the field of interface materials, and relates to a heat-conducting interface material with controllable viscosity, a preparation method and application thereof. Background technique [0002] As electronic devices get smaller and run faster, the amount of energy dissipated as heat increases dramatically. The industry's Changjiang thermal interface material is used on heat-generating devices to transfer excessive heat dissipated by the interface. [0003] At present, in the field of thermal interface materials, with the development of the industry, customers' requirements for products have changed significantly: First, in addition to the requirements of high thermal conductivity, customers are paying more and more attention to the compressibility of materials, especially the compressibility of products properties, compressive stress and compressive residual stress. The customer requested that the material not only be highly com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14H05K7/20
CPCC09K5/14H05K7/2039
Inventor 申景博赵敬棋冯梦凰
Owner TIANJIN LAIRD TECH LTD
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