Graphic manufacturing method for gradationally etching electroplating thick gold micro-strip board
A technology of electroplating thick gold and manufacturing methods, which is applied to the reinforcement of conductive patterns, the removal of conductive materials by chemical/electrolytic methods, and the manufacture of printed circuits. It can solve the problems of high risk of use, failure of microstrip line signal matching, microstrip board Can not be placed in the air for a long time and other problems, to achieve the stability and reliability of the work, to meet the effect of telecommunications performance and reliability
Active Publication Date: 2017-09-29
ANHUI SUN CREATE ELECTRONICS
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Problems solved by technology
The former can realize the microstrip pattern of the full-coverage electroplating thick gold layer, but the difficulty lies in the fact that there are so many process lines, whether it is manual removal process lines or etching removal process lines, the production efficiency is very low
Although the latter can achieve gold plating without process lines, it will cause the side wall of the electroplated thick gold pad, that is, the pad position of the microstrip board, to be unable to be wrapped by thick gold, and then there will be copper exposed on the side. The microstrip board produced by this method It cannot be placed in the air for a long time, especially when it is used in harsh environments such as humidity, the exposed copper will gradually oxidize and corrode, which is likely to cause microstrip line signal matching failure, and the risk of use is greater
Method used
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[0033] figure 1 As a specific embodiment diagram, the surface structure of the microstrip plate manufactured according to the present invention is given. Among them, D1 is the fully covered gold-plated microstrip line etched for the first time, and D2 is the pattern etched for the second time with thick gold as the resist layer.
[0034] For ease of understanding, combined here Figure 2-8 The implementation process of the present invention is further described as follows:
[0035] Concrete operation steps of the present invention refer to figure 2 As shown, the specific operation process is as follows:
[0036] (1), such as image 3 As shown, a common dry film 30 is pasted on the copper surface 20 of the substrate 10, and there is no special requirement for the brand of the dry film. At the same time, metallized via holes 40 that require thick gold plating are arranged on the substrate 10 .
[0037] (2) The 0.1-0.2 mm range around the microstrip line is not exposed, an...
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Abstract
The invention belongs to the field of micro-strip board manufacturing, and specifically relates to a graphic manufacturing method for gradationally etching an electroplating thick gold micro-strip board. The method comprises the following steps: carrying out first film laminating, first exposure developing treatment, first acid etching, first film retreating and second film laminating on a substrate copper surface; carrying out second exposure developing treatment, electroplating thick gold so as to form a thick gold area, carrying out second film retreating, and carrying out second alkaline etching. The method meets the requirement of micro-strip line full-coverage type plated thick gold, also meets the requirement of reducing connecting process lines, and simultaneously also meets the requirements of telecommunications and gold wire welding. The method is particularly suitable for manufacturing thick gold micro-strip boards applied in severe rugged environments such as moist, so that the finished product quality, work stability and reliability of the micro-strip board can be effectively guaranteed.
Description
technical field [0001] The invention belongs to the field of microstrip plate production, in particular to a pattern production method for step-by-step etching and electroplating thick gold microstrip plates. Background technique [0002] Thick gold plating with a thickness of ≥ 2 μm is a surface coating method that is maturely applied to microstrip boards. It has excellent solderability, corrosion resistance, and excellent telecommunications performance; especially in the gold wire welding process, electroplating The excellence of thick gold is unmatched by other surface coating methods. At present, there are usually two methods of electroplating thick gold: one is to etch the microstrip pattern and process lines first, and then conduct conductive electroplating of thick gold through the process lines. The other is to electroplate thick gold first, and then use the gold-plated layer as a resist layer to etch the microstrip pattern. The former can realize the microstrip pa...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/06H05K3/24
CPCH05K3/06H05K3/243H05K2203/052H05K2203/0723H05K2203/14
Inventor 杨纯
Owner ANHUI SUN CREATE ELECTRONICS