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COB encapsulation structure protected by Zener diode

A Zener diode and packaging structure technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of COB packaging structure protection, LED chip lighting and heat dissipation effects, and achieve the effect of multiple installation spaces

Pending Publication Date: 2017-10-13
XIAMEN UM OPTO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the COB packaging structure of LEDs, various protections (such as current limiting, transient voltage, etc.) for each LED chip are also gradually improved, but various protections for the overall COB packaging structure have not yet been implemented. At the same time, the existing protection Since it acts directly on the LED chip, it is bound to have a certain impact on the functions of the LED chip itself, such as light emission and heat dissipation.

Method used

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  • COB encapsulation structure protected by Zener diode
  • COB encapsulation structure protected by Zener diode
  • COB encapsulation structure protected by Zener diode

Examples

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Embodiment 1

[0029] See figure 1 with 2 As shown, the present invention relates to a COB packaging structure with zener diode protection, the implementation of the first embodiment includes a substrate 10, a positive electrode 20, a negative electrode 30 and an LED chip group 40, a positive electrode 20, and a negative electrode 30 And the LED chipset 40 is all arranged on the substrate 10, wherein the substrate 10 is a substrate with a certain heat dissipation function, and its shape includes but not limited to any one of rectangle, circle, and ellipse; the LED chipset 40 can be one or more, each LED chip group 40 is composed of multiple LED chips in series, and the two ends of the LED chip group 40 are electrically connected to the positive electrode 20 and the negative electrode 30 respectively, thereby forming a COB device of the LED. Specifically, the LED chip 41 is bonded on the substrate 10 by a crystal-bonding glue, and the fluorescent glue covers the upper surface of each LED chi...

Embodiment 2

[0032] In the second embodiment, two (or multiple) zener diodes in the same direction or in the opposite direction are connected in series to perform bidirectional protection for the COB device. For details, please refer to image 3 with 4 As shown, the present invention relates to a COB packaging structure with zener diode protection, and the implementation of the second embodiment includes a substrate 10, a positive electrode 20, a negative electrode 30 and an LED chip group 40, a positive electrode 20, a negative electrode 30 and the LED chipset 40 are both disposed on the substrate 10 . In order to suppress transient voltages (caused by electrostatic discharge or high-voltage transient signals), in the second embodiment, the COB package structure further includes two Zener diodes and a copper foil layer 60, which are the first Zener diode 51 and the second copper foil layer 60 respectively. Two zener diodes 52, wherein the first zener diode 51 and the second zener diode ...

Embodiment 3

[0043] In the third embodiment, two zener diodes in the same direction or in the opposite direction are connected in series to protect the COB device bidirectionally. For details, please refer to Figure 5 with 6 As shown, the present invention relates to a COB packaging structure with zener diode protection, and the implementation of the third embodiment includes a substrate 10, a positive electrode 20, a negative electrode 30 and an LED chip group 40, a positive electrode 20, a negative electrode 30 and the LED chipset 40 are both disposed on the substrate 10 . In order to suppress transient voltages (caused by electrostatic discharge or high-voltage transient signals), in the third embodiment, the COB package structure further includes two Zener diodes and a copper foil layer 60, which are the first Zener diode 51 and the second copper foil layer 60 respectively. Two zener diodes 52, wherein the first zener diode 51 and the second zener diode 52 are installed on the posit...

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Abstract

The invention discloses a COB encapsulation structure protected by a Zener diode, and relates to the technical field of integrated semiconductor illumination components. The COB encapsulation structure comprises a substrate, a positive electrode, a negative electrode and at least one LED chip set; the positive electrode, the negative electrode and the LED chip set are arranged on the substrate; furthermore, two ends of the LED chip set are electrically connected with the positive electrode and the negative electrode respectively; the COB encapsulation structure further comprises a Zener diode; and two ends of the Zener diode are electrically connected with the positive electrode and the negative electrode respectively. According to the COB encapsulation structure disclosed by the invention, the COB encapsulation structure, which is formed by the LED chip set, the positive electrode and the negative electrode and used as a whole, forms a COB device; and furthermore, the Zener diode having a protective circuit itself is integrated in the whole COB device, so that transient voltage can be inhibited.

Description

technical field [0001] The invention relates to integrated semiconductor lighting components, in particular to a COB packaging structure with Zener diode protection. Background technique [0002] LED (Light Emitting Diode) is a light-emitting semiconductor component. Because of its good controllability, simple structure, small size, pure and rich colors, shock resistance, vibration resistance, and fast response time, it is recognized as the most advanced technology in the 21st century. One of the most promising high-tech products, while triggering the lighting revolution, it also makes a major contribution to promoting energy conservation, emission reduction, and environmental protection. COB is the English abbreviation of Chip On Boarding (Chip On Board), which is a kind of LED chip directly pasted on the PCB (Printed Circuit Board) board by adhesive or solder, and then the chip and the PCB board are realized by wire bonding. Packaging technology for electrical interconnec...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L23/62
CPCH01L23/62H01L25/0753H01L33/48
Inventor 李恒彦王亚山黄敏李儒维
Owner XIAMEN UM OPTO TECH
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