A Method for Monitoring Debonding Damage of Insulation Layer Based on Sparse Array Tomography
A tomographic imaging and sparse array technology, applied in the direction of measuring devices, analyzing materials, processing detection response signals, etc., can solve the problems of positioning and quantification, affecting the reconstruction speed of imaging results, and increasing the burden on equipment, etc., to achieve improvement Real-time monitoring capability, avoiding inaccurate recognition, and fast reconstruction
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0069] Step 1: Take a piece such as figure 2 In the heat insulation layer test piece shown, the substrate 1 is made of an aluminum alloy plate with a thickness of 3mm and a size of 500mm×500mm. A thermal insulation layer 3 with a size of 360mm×360mm is bonded to the substrate 1, and the material is polyimide, and the selected adhesive is polyurethane glue.
[0070] Step 2: 10 piezoelectric sensors are sparsely arranged on the aluminum plate as the excitation / reception array 2 of the ultrasonic guided wave, such as figure 2 shown, and formed as image 3 The 35 monitoring paths shown are denoted as M;
[0071] Step 3: Take the center of the substrate as the coordinate origin and each sensor as the boundary of the monitoring area to establish a rectangular coordinate system. The monitoring area is discretized into a grid and numbered from 1 to Z. In this example, the grid size is 20mm×20mm, and a total of 18×18=324 grids are obtained, such as Figure 4 shown. The order of...
PUM
| Property | Measurement | Unit |
|---|---|---|
| electrical bandwidth | aaaaa | aaaaa |
| diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


