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A Method for Monitoring Debonding Damage of Insulation Layer Based on Sparse Array Tomography

A tomographic imaging and sparse array technology, applied in the direction of measuring devices, analyzing materials, processing detection response signals, etc., can solve the problems of positioning and quantification, affecting the reconstruction speed of imaging results, and increasing the burden on equipment, etc., to achieve improvement Real-time monitoring capability, avoiding inaccurate recognition, and fast reconstruction

Active Publication Date: 2020-06-19
大连君晟科技有限责任公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when monitoring the debonding of the thermal insulation layer, the debonding damage usually does not produce obvious guided wave scattering echoes, and the traditional guided wave imaging method based on weighted probability is seriously affected for the location and quantification of this type of damage.
[0004] Ray tomography has high accuracy for damage identification without obvious scattering or diffraction phenomenon, but usually requires a dense sensor array, which increases the burden on equipment and affects the reconstruction speed of imaging results. In practical engineering applications have certain limitations

Method used

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  • A Method for Monitoring Debonding Damage of Insulation Layer Based on Sparse Array Tomography
  • A Method for Monitoring Debonding Damage of Insulation Layer Based on Sparse Array Tomography
  • A Method for Monitoring Debonding Damage of Insulation Layer Based on Sparse Array Tomography

Examples

Experimental program
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Embodiment

[0069] Step 1: Take a piece such as figure 2 In the heat insulation layer test piece shown, the substrate 1 is made of an aluminum alloy plate with a thickness of 3mm and a size of 500mm×500mm. A thermal insulation layer 3 with a size of 360mm×360mm is bonded to the substrate 1, and the material is polyimide, and the selected adhesive is polyurethane glue.

[0070] Step 2: 10 piezoelectric sensors are sparsely arranged on the aluminum plate as the excitation / reception array 2 of the ultrasonic guided wave, such as figure 2 shown, and formed as image 3 The 35 monitoring paths shown are denoted as M;

[0071] Step 3: Take the center of the substrate as the coordinate origin and each sensor as the boundary of the monitoring area to establish a rectangular coordinate system. The monitoring area is discretized into a grid and numbered from 1 to Z. In this example, the grid size is 20mm×20mm, and a total of 18×18=324 grids are obtained, such as Figure 4 shown. The order of...

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Abstract

The invention discloses an adiabatic layer debonding damage monitoring method based on sparse array tomography, the adiabatic layer debonding damage monitoring method includes the following steps: firstly, a monitoring area of a to-be-tested structure is discretized into a plurality of small grids, and a sparse piezoelectric sensor array is arranged at the boundary of the monitoring area, and is used as an ultrasonic guided wave excitation end and receiving end; sensors are in turn motivated, other sensors receive, an ultrasonic guided-wave echo signal acquired when an adiabatic layer is in a good bonding state is used as reference signal E, an ultrasonic guided-wave echo signal acquired under a state waiting for inspection is used as monitoring signal E '; signal difference between the reference signal E and the monitoring signal E' is used as tomography projection coefficient C, and initial solution can be reconstructed by adaptive algebra iterative algorithm (ART); and by substitution into regularized treatment (TV), the ill-posed nature of a solved sparse matrix is improved, and results of the iterative method are modified until higher imaging accuracy is obtained.

Description

technical field [0001] The invention relates to a method for monitoring debonding damage of a thermal insulation layer based on sparse array tomography, and belongs to the field of health monitoring of plate engineering structures with a thermal insulation layer. Background technique [0002] The aerospace field at home and abroad is facing an ever-increasing demand for space delivery. For this reason, all major aerospace countries in the world are looking for ways to reduce the launch cost of space vehicles, improve reliability, safety and mission adaptability, and reusable delivery vehicles are convenient. It is one of the important development projects. As an ideal propellant, liquid hydrogen / liquid oxygen propellants are widely used in reusable launch vehicles. The boiling point of liquid hydrogen / liquid oxygen is very low, and it is usually necessary to use adhesives to bond the heat insulation layer structure to the surface of the tank base to realize the heat insulat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N29/06G01N29/44
CPCG01N29/0672G01N29/44
Inventor 郑跃滨马书义刘科海武亦凡
Owner 大连君晟科技有限责任公司