Binary and multi-valued memristor based on HfO2-x, preparation method, and application of binary and multi-valued memristor
A 1.8 is unfavorable for memristor integration, unable to meet the demanding requirements of special-purpose chips, and functional decline.
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Embodiment 1
[0074] Example 1: Binary HfO 2-x Memristor
[0075] The binary HfO provided by embodiment 1 2-x Memristor, Pt / HfO with 8*8crossbar array structure x / Ti memristor, whose structure is as figure 1 shown; where the bottom electrode is Pt with a thickness of 100nm, and the functional layer is HfO with a thickness of 19.5nm 2-x , 2-x=1.93; the upper electrode is Ti with a thickness of 100nm.
[0076] The binary HfO of embodiment 1 is specifically described below 2-x The preparation method of memristor; Concrete steps are as follows:
[0077] (1) The first step: prepare the lower electrode:
[0078] (1.1) Photolithography: in the long SiO 2 One or more strip-shaped lower electrode patterns are prepared by a photolithography process on the Si substrate of the insulating layer;
[0079] Among them, the photolithography process includes: the steps of uniform glue, pre-baking, pre-exposure, post-baking, post-exposure, developing, coating, and stripping;
[0080] Sputtering: The...
Embodiment 2
[0094] Example 2: Multivalued HfO 2-x Memristor
[0095] The multi-valued HfO provided by embodiment 2 2-x Memristor, Pt / HfO with 8*8crossbar array structure x / Ti memristor, whose structure is as figure 1 shown; where the bottom electrode is Pt with a thickness of 100nm, and the functional layer is HfO with a thickness of 19.5nm 2-x , 2-x=1.69; the upper electrode is Ti with a thickness of 100nm.
[0096] The multi-valued HfO of embodiment 2 is specifically described below 2-x The preparation method of memristor; Concrete steps are as follows:
[0097] (1) The first step: preparing the lower electrode;
[0098] (1.1) Photolithography: in the long SiO 2 One or more strip-shaped lower electrode patterns are prepared by a photolithography process on the Si substrate of the insulating layer;
[0099] Among them, the photolithography process includes: the steps of uniform glue, pre-baking, pre-exposure, post-baking, post-exposure, developing, coating, and stripping;
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