Preparation method of elastic conductive paste

An elastic conductive, paste technology, applied in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve problems such as poor tensile electrical stability, changes in resistance characteristics, and low initial conductivity

Active Publication Date: 2017-11-03
袁伟
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Problems solved by technology

[0004] Although there have been reports on the direct mixing of conductive nanomaterials and elastic polymers to obtain elastic conductive pastes, there is still a very important problem in the elastic pastes prepared at present, such as low initial conductivity and poor tensile electrical stability. Seriously restricts the application of elastic conductive paste
The reason for the low initial conductivity is mainly because the elastic conductive paste must ensure a certain degree of scalability under the premise of satisfying the conductivity, so the proportion of conductive filler will be much lower than that of ordinary conductive paste. , so the initial conductivity of the current elastic conductive paste is relatively low; the reason for the poor electrical stability of stretching is mainly that the conductive fillers of the current elastic conductive paste are basically metal particles or carbon black powders that do not have an a

Method used

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  • Preparation method of elastic conductive paste

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specific Embodiment 1

[0019] Specific embodiment one, please refer to figure 1 , a preparation method of elastic conductive paste, the steps are:

[0020] (1) First, carry out ligand exchange treatment on the surface of silver nanowires with an aspect ratio of 100-5000: 1, so that the surface is covered with a layer of non-polar groups, and then the silver nanowires are coated with 20-60wt% by weight Disperse in a non-polar solvent and make a stable dispersion for use;

[0021] (2) dissolving the elastic polymer in a non-polar solvent, according to the polymer solution of 10-50wt% by weight;

[0022] (3) The dispersion liquid prepared in step (1) and the polymer solution prepared in step (2) are mechanically mixed according to the mass ratio of the silver nanowires in the dispersion liquid to the elastic polymer in the polymer solution being 1.5-3.5:1 , and then add water-soluble nonionic surfactant whose mass is 10-30% of the mass of silver nanowires to the mixed system, and finally prepare the ...

specific Embodiment 2

[0024] Specific embodiment two, please refer to figure 1 , a preparation method of elastic conductive paste, the steps are:

[0025] (1) Firstly, ligand exchange treatment is performed on the surface of copper nanowires with an aspect ratio of 100-5000:1, so that the surface is covered with a layer of non-polar groups, and then the copper nanowires are coated with 20-60wt% by weight Disperse in a non-polar solvent and make a stable dispersion for use;

[0026] (2) dissolving the elastic polymer in a non-polar solvent, according to the polymer solution of 10-50wt% by weight;

[0027] (3) The dispersion liquid prepared in step (1) and the polymer solution prepared in step (2) are mechanically prepared according to the mass ratio of the copper nanowire in the dispersion liquid to the elastic polymer in the polymer solution being 1.5-3.5:1. mixing, and then adding a water-soluble nonionic surfactant whose mass is 10-30% of the mass of copper nanowires to the mixing system, and f...

specific Embodiment 3

[0029] Specific embodiment three, please refer to figure 1 , a preparation method of elastic conductive paste, the steps are:

[0030] (1) First, carry out ligand exchange treatment on the surface of gold nanowires with an aspect ratio of 100-5000:1, so that the surface is covered with a layer of non-polar groups, and then the gold nanowires are coated with 20-60wt% by weight Disperse in a non-polar solvent and make a stable dispersion for use;

[0031] (2) dissolving the elastic polymer in a non-polar solvent, according to the polymer solution of 10-50wt% by weight;

[0032] (3) The dispersion liquid prepared in step (1) and the polymer solution prepared in step (2) are mechanically prepared according to the mass ratio of the gold nanowires in the dispersion liquid to the elastic polymer in the polymer solution being 1.5-3.5:1. mixing, then adding a water-soluble nonionic surfactant whose mass is 10-30% of the mass of the gold nanowires to the mixing system, and finally mix...

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Abstract

The invention relates to the technical field of flexible electronics, in particular to a preparation method of elastic conductive paste. The elastic conductive paste prepared by the method of the elastic conductive paste can be used for printing and processing. The problems solved by the preparation method of the elastic conductive paste are as follows: (1) uniformly mixing of conductive filler with high length-diameter ratio and an elastic polymer is solved, so that a uniform conductive network structure is formed in the elastic paste, and high stretching electrical stability is achieved; and (2) by adding a surfactant, the solvent evaporation and phase separation process during the drying process of the paste is facilitated, more conductive filer is generated on a surface of a paste system, so that the initial conductivity is improved. The preparation method of the elastic conductive paste is reasonable in structural design, high-efficiency and rapid preparation is achieved, and the preparation method is suitable for promotion and application.

Description

technical field [0001] The invention relates to the technical field of flexible electronics, in particular to a method for preparing elastic conductive paste. Background technique [0002] Flexible electronics refers to a type of electronic device that still maintains normal functions during the process of bending, folding or even stretching deformation under the action of external force. Compared with traditional electronic products based on rigid circuit board technology, flexible electronics can be directly applied to the three-dimensional free-form surface working environment, promote the fusion and interaction of human-machine information in the fields of biomedicine, leisure and entertainment, and meet the requirements of portability and comfort. Therefore, it will greatly expand the application range of current electronic products, so it has received extensive attention from academia and industry [0003] In order to adapt to the development of flexible electronics, ...

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B1/22
CPCH01B1/22H01B13/00
Inventor 袁伟朱杨
Owner 袁伟
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