Tissue pain grading method and tissue pain grading device

A grading method and a grading device technology, applied in the field of medical devices, can solve the problems that the results are not objective and accurate, and cannot organize the quantitative analysis of the degree of pain, etc., and achieve the effect of simple structure

Inactive Publication Date: 2017-11-07
深圳市亿领科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the analysis of tissue mechanical properties is not combined, the results are not objective and accurate enough, and the degree of tissue pain cannot be quantitatively analyzed intuitively.

Method used

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  • Tissue pain grading method and tissue pain grading device
  • Tissue pain grading method and tissue pain grading device
  • Tissue pain grading method and tissue pain grading device

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Embodiment Construction

[0028] In order to express the present invention more clearly, the present invention will be further described below in conjunction with the accompanying drawings.

[0029] see Figure 1-3 The device for grading tissue pain and measuring related mechanical properties provided by the present invention includes a control module 7, a plurality of information collectors, a measuring probe 1, and a skin conductance sensor that can be attached to the periphery of the tissue to be tested or to a site prone to sweating. A conductivity sensor 6; the measuring probe 1 and the skin conductivity sensor 6 are respectively connected to a plurality of information collectors, and a plurality of information collectors are connected to a control module;

[0030] The measuring probe 1 includes a mechanical sensor 2 and an ultrasonic sensor 3 connected thereto. The ultrasonic sensor can act on the measured point 5 of the measured tissue 4 as an indenter, and can obtain ultrasonic echo information...

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Abstract

The invention discloses a tissue pain grading method and a tissue pain grading device. The tissue pain grading device comprises a control module, a plurality of information collectors, a measurement probe and skin conductivity sensors, and the skin conductivity sensors can be attached around tested tissue or at portions prone to sweating. The measurement probe and the skin conductivity sensors are connected with the information collectors which are connected with the control module. The measurement probe comprises a mechanical sensor and an ultrasonic sensor connected with the mechanical sensor, the ultrasonic sensor can serve as an indentation head for acting on a tested point of the tested tissue and is capable of acquiring ultrasonic echo information of tissue structures to realize tissue deformation measurement, and the skin conductivity sensors are attached to the tissue to measure skin conductivity. The tissue pain grading device is simple in structure, convenient, practical and capable of positioning and locally analyzing tissue pain and related mechanical properties.

Description

technical field [0001] The invention relates to the technical field of medical devices, in particular to a tissue pain grading method and a device thereof. Background technique [0002] Pain is a subjective feeling of people, and the feeling of pain is produced by pain receptors on nerve endings. When the receptors are stimulated, a signal is sent to the brain through the spinal cord, causing pain. At present, the intensity of pain mainly depends on the patient's own judgment of the degree of pain, or the doctor analyzes it by observing the patient's facial expression. Because the analysis of tissue mechanical properties is not combined, the results are not objective and accurate enough, and the degree of tissue pain cannot be quantitatively analyzed intuitively. Contents of the invention [0003] Aiming at the deficiencies in the above-mentioned technologies, the present invention provides a method and device for grading tissue pain with a simple structure, convenience ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B5/00A61B5/053A61B8/08
Inventor 王立科
Owner 深圳市亿领科技有限公司
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