Embossing equipment for zip-lock bag

Abstract

The invention discloses embossing equipment for a zip-lock bag. The equipment comprises a rack, an embossing roller, sliding rail mechanisms, a space adjustment mechanism, a conveying platform and a driving wheel, wherein a base is arranged at the bottom of the rack; a driving roller is fixedly mounted above the base and is mounted on the rack through a shaft rod A; the driving wheel is fixedly mounted at one end of the shaft rod A in a matching manner; the embossing roller is mounted on the rack through a shaft rod B; two ends of the shaft rod B are connected with the sliding rail mechanisms; the space adjustment mechanism is mounted in the middle of the sliding rail mechanisms and is connected with the sliding rail mechanisms; an embossing texture A and an embossing texture B are respectively arranged on outer surfaces of the embossing roller and the driving roller and are staggered with each other; and the shapes of the embossing texture A and the embossing texture B are designed according to actual demands. The embossing equipment has the beneficial effects that the equipment has an embossing function, is convenient to use and is high in working efficiency.

Description

technical field [0001] The invention relates to a self-sealing bag embossing equipment. Background technique [0002] The quartz wafer is the main part of the quartz crystal resonator. It vibrates under the excitation of the electric field to output a stable frequency. The quality of the wafer directly determines the performance of the resonator. [0003] With the gradual development of electronic equipment in the direction of lightness and thinness, the space left for internal components is getting smaller and smaller. Therefore, the miniaturization and low power consumption of components have become the mainstream development direction. Quartz crystal resonators are no exception and are widely used in smart phones, and quartz chips are becoming more and more miniaturized. The finished chip is packaged in a ziplock bag. The inner wall of the ziplock bag currently on the market contains anti-static powder to prevent the chip from sticking to the inner wall of the ziplock ba...

AI Technical Summary

Problems solved by technology

However, due to the liquefaction of the antistatic powder with the change of the temperature and humidity of the environment, the wafer will be polluted again

At present, this phenomenon has been complained by customers many times about the oil pollution on the surface of the chip.

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