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Positive photosensitive resin composition and insulating film produced therefrom

A technology of photosensitive resin and composition, which is applied in the field of insulating film and positive photosensitive resin composition, which can solve the problems of high sensitivity and achieve excellent adhesion and uniformity

Active Publication Date: 2022-03-08
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, there is a problem that in order to improve the adhesion between the organic insulating film and the substrate, the substrate is treated with hexamethyldisilazane or the like during the process, and at this time, treatment such as hexamethyldisilazane is required. additional process
However, the above existing literature has the problem of high sensitivity

Method used

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  • Positive photosensitive resin composition and insulating film produced therefrom
  • Positive photosensitive resin composition and insulating film produced therefrom
  • Positive photosensitive resin composition and insulating film produced therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～14 and comparative example 1～3

[0135] A photosensitive resin composition having the composition and content described in Table 1 below was produced.

[0136] 【Table 1】

[0137]

[0138] A1-1.(a) / (b)=60 / 40

[0139] A1-2.(a) / (b)=70 / 30

[0140]

[0141] A2-1: (a) / (b) / (c)=20 / 60 / 20

[0142] A2-2: (a) / (b) / (c)=30 / 50 / 20

[0143]

[0144] R: ethyl

[0145] A3-1: (a) / (b) / (c) / (d)=15 / 10 / 50 / 25

[0146] A3-2: (a) / (b) / (c) / (d)=25 / 15 / 30 / 30

[0147]

[0148] (B)

[0149]

[0150] (C)

[0151]

[0152] (D1) Propylene Glycol Methyl Ethyl Acetate

[0153] (D2) Diethylene glycol methyl ethyl ester

[0154] (E) Dicyclohexylmethylamine

[0155] (F) KBM-403 (γ-glycidoxypropyltrialkoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.)

[0156] (G1) SH-8400 (manufactured by Toray-Dow Corning)

[0157] (G2) F-475 (manufactured by DIC Corporation)

experiment example

[0159] The following evaluations were performed about the resin compositions produced in Examples 1 to 14 and Comparative Examples 1 to 3, and the results are shown in Table 2 below.

[0160] (1) Sensitivity measurement

[0161] A 0.7 mm thick glass substrate (CORNING 1737, manufactured by Corning Incorporated) was coated with the photosensitive resin compositions of Examples and Comparative Examples using a spin coater, and heated on a hot plate at 100° C. for 125 seconds to volatilize the solvent. , a photosensitive resin composition layer with a thickness of 4.0 μm was formed.

[0162] Then, in order to obtain a contact hole pattern having a diameter of 10 μm, exposure was performed with an i-ray stepper (NSR-205i11D, Nikon Corporation) using a mask having a square pattern opening portion having a side of 10 μm in the exposure portion.

[0163] The exposed substrate was subjected to spin-over immersion development at 23°C for 40 seconds using a 2.38% tetramethylammonium hy...

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Abstract

The present invention relates to a positive-type photosensitive resin composition and an insulating film produced therefrom, more specifically, a positive-type photosensitive resin composition, which is characterized in that it comprises a binder resin comprising: (a ‑1) A resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid-decomposable group, (a‑2) an acrylic resin containing a silyl ether group, and (a‑3) an acrylic resin containing an epoxy group resin.

Description

technical field [0001] The present invention relates to a positive photosensitive resin composition for obtaining an insulating film excellent in adhesion and uniformity, and an insulating film produced therefrom. Background technique [0002] In display devices such as thin film transistor (TFT, Thin Film Transistor) type liquid crystal display devices, inorganic protective films such as silicon nitrides have been conventionally used as protective films for protecting and insulating TFT circuits. In order to overcome the problem that it is difficult to increase the aperture ratio due to the high value of the dielectric constant, the demand for an organic insulating film with a low dielectric constant tends to increase. [0003] As such an organic insulating film, a photosensitive resin is generally used. The photosensitive resin is a polymer compound whose solubility in a specific solvent changes by chemical reaction with light and an electron beam. The microfabrication of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/039G02F1/1333
CPCG02F1/133345G03F7/004G03F7/039Y02P20/582G03F7/0392G03F7/0048G03F7/032H01L21/02225
Inventor 任玟柱金径录赵庸桓
Owner DONGWOO FINE CHEM CO LTD