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Low-loss component embedded antenna packaging structure and manufacturing method thereof

A technology of packaging structure and manufacturing method, which is applied in the direction of antenna support/mounting device, semiconductor/solid-state device manufacturing, antenna, etc., can solve the problems of low mechanical strength or rigidity, affecting strength, etc., achieve balanced warpage and ensure stability , Increase the effect of structural strength

Inactive Publication Date: 2017-11-10
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Antenna is a necessary component in wireless communication equipment. Under the requirements of integration, miniaturization and miniaturization of portable wireless communication equipment, the current method used is through system-level packaging, which can integrate as many passive components, Low-power active devices and antennas are embedded in the substrate, which requires the substrate to have as low a dielectric loss as possible. At the same time, the technical trend requires the substrate to be as thin as possible. However, low-loss substrates or other materials generally have lower mechanical strength or rigidity. low, which will affect the strength of the overall package

Method used

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  • Low-loss component embedded antenna packaging structure and manufacturing method thereof
  • Low-loss component embedded antenna packaging structure and manufacturing method thereof
  • Low-loss component embedded antenna packaging structure and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0045] Example 1: Chips and low-loss components are located on both sides of the substrate

[0046] see figure 1 , a low-loss component embedded antenna packaging structure in this embodiment, it includes a substrate 1, the substrate 1 includes a multilayer circuit layer 1.1 and a low-loss insulating material 1.2, and the multilayer circuit layer 1.1 includes an antenna area 1.3, the front of the substrate 1 is provided with a low-loss component 2, the low-loss component 2 covers the antenna area 1.3 of the multi-layer circuit layer 1.1, the upper part of the substrate 1 and the peripheral area of ​​the low-loss component 2 are encapsulated with a plastic encapsulant 3, Chips 4 and metal balls 6 are arranged on the back of the substrate 1;

[0047] The chip 4 is flip-chip mounted on the back of the substrate 1 through the underfill glue 5;

[0048] The low-loss component 2 has a low dielectric constant (Dk20 GHz).

[0049] Its manufacturing method comprises the following st...

Embodiment 2

[0062] Example 2: The chip and the low-loss component are located on the same side of the substrate

[0063] see Figure 14 , a low-loss component-embedded antenna packaging structure in this embodiment, which includes a substrate 1, the substrate 1 includes a multilayer circuit layer 1.1 and a low-loss insulating material 1.2, and the multilayer circuit layer 1.1 includes an antenna area 1.3, the front of the substrate 1 is provided with a low-loss component 2 and a chip 4, the low-loss component 2 covers the antenna area 1.3 of the multilayer circuit layer 1.1, and the peripheral area of ​​the low-loss component 2 and the chip 4 above the substrate 1 covers A plastic molding compound 3 is sealed, and a metal ball 6 is arranged on the back of the substrate 1 .

Embodiment 3

[0065] see Figure 15 The difference between embodiment 3 and embodiment 1 is that the back of the low-loss component 2 is not encapsulated by the molding compound 3 .

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Abstract

The invention relates to a low-loss component embedded antenna packaging structure and a manufacturing method thereof. The structure comprises a substrate (1), wherein the substrate (1) comprises a plurality of circuit layers (1.1) and a low-loss insulating material (1.2); the plurality of circuit layers (1.1) comprise antenna regions; a front side of the substrate (1) is provided with a low-loss component (2); the low-loss component (2) covers the antenna regions of the plurality of circuit layers (1.1); a peripheral region of the low-loss component (2) on the substrate (1) is encapsulated with a molding compound (3); and a back side of the substrate (1) is provided with a chip (4) and metal balls (6). Through adoption of the low-loss component embedded antenna packaging structure and the manufacturing method thereof, the structural strength of a thin substrate is enhanced; the stability of the antenna regions heated during working is ensured; deformation of an antenna is prevented; and the stability of an antenna signal is ensured.

Description

technical field [0001] The invention relates to a low-loss component embedded antenna packaging structure and a manufacturing method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] Antenna is a necessary component in wireless communication equipment. Under the requirements of integration, miniaturization and miniaturization of portable wireless communication equipment, the current method used is through system-level packaging, which can integrate as many passive components, Low-power active devices and antennas are embedded in the substrate, which requires the substrate to have as low a dielectric loss as possible. At the same time, the technical trend requires the substrate to be as thin as possible. However, low-loss substrates or other materials generally have lower mechanical strength or rigidity. Low, which will affect the strength of the overall package. Contents of the invention [0003] The technical problem to b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/56H01L23/31H01L23/66H01Q1/22
CPCH01L21/50H01L21/568H01L23/3128H01L23/66H01L2223/66H01Q1/2283H01L2224/73204
Inventor 林耀剑
Owner JCET GROUP CO LTD