Black hole quality testing board for PCB, and quick examination method

Abstract

Four corners and the central part of a copper-coated double-side plate are provided with the dedicated testing groups and through hole groups, so as to prepare a PCB black hole quality testing board. The method comprises the steps: carrying out the black hole direct electroplating of the PCB black hole quality testing board, detecting a resistance value R1 between two testing bonding pads in each testing group and a resistance value R3 between circuit bonding pads at two ends of he through holes, and comparing the resistance values R1 and R3 with a preset surface black hole film resistance standard value R2 and a preset in-hole black hole film resistance standard value R4, thereby achieving the purpose of quick examination. Before the black hole direct electroplating of a PCB product, the PCB black hole quality testing board can be used for testing and inspection, so as to pre-judge the machining quality of the black-hole direct electroplated surface black hole film and in-hole black hole, provide reference for the early finding of technological defects and the adjustment of the technological parameters, and prevent poor quality from causing waste during the black-hole direct electroplating of the PCB product.

Description

technical field [0001] The invention relates to a direct electroplating technology for black holes on a PCB board, in particular to a PCB black hole quality test board and a rapid inspection method. Background technique [0002] Black hole direct electroplating technology is a new technology to replace electroless copper plating. It uses a black solution composed of fine carbon black or graphite with strong conductivity, collectively referred to as black hole liquid, and the English name is Blackhole. It is characterized in that it simplifies the process of metallizing holes, saves working hours, reduces material consumption, effectively controls the discharge of waste water, and reduces the production cost of printed boards. The black hole liquid has good stability, and no hydrogen gas is released during the adsorption process of the through-hole copper clad laminate. However, the black hole process requires copper plating before using the backlight section method to dete...

AI Technical Summary

Problems solved by technology

However, the black hole process needs to be copper-plated before using the method of backlight sectioning to detect whether the quality of the black hole is normal, so it is impossible to effectively prevent and control the quality of the black hole

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