Novel process for increasing surface tension of metal product

A surface tension and product technology, applied in the field of electronic materials, can solve the problems of difficulty in coating the surface of electronic components, inability to coat, and non-interference of functions, and achieve the effect of solving the difficulty or even inability to coat the surface of electronic components and having a compact structure.

Inactive Publication Date: 2017-11-28
AQ HOLMBERGS SUZHOU LTD CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main technical problem to be solved by the present invention is to provide a new process for increasing the surface tension of metal products, which can overcome the difficulty of coating the surface of electronic components, or even the difficulty of coating, so as to achieve the electronic components with compact structure and non-interfering functions. Effect

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] 1. Select SUS304 1 / 2H stainless steel raw material with a thickness of 0.2mm. At this time, the measured dyne value is 34. Electroplating treatment is performed on this material. The electroplating treatment specifically includes the following steps:

[0030] 1) Electrolytic degreasing: Degreasing with an electrolyte solution with a concentration of 30g / L, set the temperature at 70°C for 2 minutes;

[0031] 2) Washing after degreasing: rinse with ordinary tap water for 30 seconds;

[0032] 3), pickling: use 15% sulfuric acid solution to carry out pickling at normal temperature for 2 minutes;

[0033] Four), washing after pickling: rinse with ordinary tap water for 30 seconds;

[0034] 5) Gold plating: Gold plating setting conditions: water quality ≤ 40μs / cm pure water, temperature 30 degrees, current 1A / dm2; gold plating thickness is controlled by 1.2 times the minimum value of gold plating film thickness;

[0035] 6) Water washing after gold plating: rinse with ordin...

Embodiment 2

[0047] 1. Select SUS304 1 / 2H stainless steel raw material with a thickness of 0.2mm. At this time, the measured dyne value is 34. Electroplating treatment is performed on this material. The electroplating treatment specifically includes the following steps:

[0048] 1) Electrolytic degreasing: degreasing with an electrolyte solution with a concentration of 15g / L, set the temperature at 55°C for 2 minutes;

[0049] 2) Washing after degreasing: rinse with ordinary tap water for 30 seconds;

[0050] 3), pickling: use 15% sulfuric acid solution to carry out pickling at normal temperature for 2 minutes;

[0051] Four), washing after pickling: rinse with ordinary tap water for 30 seconds;

[0052] 5) Gold plating: Gold plating setting conditions: water quality ≤ 40μs / cm pure water, temperature 30 degrees, current 0.5A / dm2; gold plating thickness is controlled by 1.2 times the minimum value of gold plating film thickness;

[0053] 6) Water washing after gold plating: rinse with ord...

Embodiment 3

[0065] 1. Select SUS304 1 / 2H stainless steel raw material with a thickness of 0.2mm. At this time, the measured dyne value is 34. Electroplating treatment is performed on this material. The electroplating treatment specifically includes the following steps:

[0066] 1) Electrolytic degreasing: Degreasing with an electrolyte solution with a concentration of 40g / L, set the temperature at 95°C, and the duration is 3 minutes;

[0067] 2) Washing after degreasing: rinse with ordinary tap water for 35 seconds;

[0068] 3), pickling: carry out pickling at room temperature with 17% sulfuric acid solution, the duration is 2 minutes;

[0069] Four), washing after pickling: rinse with ordinary tap water for 35 seconds;

[0070] 5) Gold plating: Gold plating setting conditions: water quality ≤ 40μs / cm pure water, temperature 32 degrees, current 1.2A / dm2; gold plating thickness is controlled by 1.2 times the minimum value of gold plating film thickness;

[0071] 6) Water washing after gold...

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PUM

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Abstract

The invention discloses a novel process for increasing a surface tension of a metal product, and belongs to the technical field of electronic materials. A surface tension coefficient of a material is commonly known as a Dyne value, and replaced by the Dyne value hereinafter. The novel process disclosed by the invention comprises the steps of carrying out an improved electroplating process on a raw material of the metal product at first, and the improved electroplating process comprises the steps of 1) electrolytic degreasing, 2) water cleaning, 3) acid cleaning, 4) water cleaning, 5) gold plating, 6) water cleaning, 7) gold peeling, 8) water cleaning, 9) ultrasonic hot water cleaning and 10) drying; then carrying out stamping with grease protection; and cleaning after the stamping, and the cleaning comprises the steps of 1) hydrocarbon cleaning, 2) hydrocarbon cleaning and 3) steam drying; and in this way, the Dyne value of the final product is increased, and an adhesion force of a product with a high Dyne value during surface film coating is high, so that coated films with various functions such as a waterproof function, an anti-static function, an insulation function and a heat-isolation function can be long-term effective, and finally, quality and life of the product are ensured. The novel process disclosed by the invention is high in practicability, and capable of being greatly used for electronic components, thereby improving special performance of the various electronic components in various aspects.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a novel process for increasing the surface tension of metal products. Background technique [0002] Today's electronic products have more and more functions, and they are getting smaller and smaller. In the past, the functional areas of electronic products were separated, and the respective spaces did not interfere with each other, so the appearance and volume were large. However, the popular trend in modern society is more and more functions, smaller and smaller volumes, and higher integration of electronic components, making the space smaller and smaller. This requires the integration of each functional module in the electronic product. In addition to reducing the size of the module itself, it is also necessary to overlap and use the space of each module to save the entire product space as much as possible. Then the problem comes, the functional modules are very ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/00C25D3/48C23G5/024B21D22/02B21D37/18
CPCC25D5/00B21D22/02B21D37/18C23G5/024C25D3/48
Inventor 王艺郝湘周志斌沈兵
Owner AQ HOLMBERGS SUZHOU LTD CHINA
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