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Manufacturing method of light-emitting diode packaging structure

A technology of light-emitting diodes and packaging structures, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as crushing, chip damage, and unstable chip position accuracy, so as to prevent damage, improve yield and reliability, and increase The effect of product yield

Active Publication Date: 2020-02-11
QUANZHOU SANAN SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the transparent plastic molding process (Molding) in this CSP structure usually adopts a hard mold with a raised three-dimensional trapezoid. Because the position accuracy of the chip is unstable, it is easy to be crushed with the raised three-dimensional trapezoid of the hard mold, resulting in damage to the chip. ,like image 3 As shown, so it is necessary to develop a new manufacturing method of light-emitting diode packaging structure

Method used

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  • Manufacturing method of light-emitting diode packaging structure
  • Manufacturing method of light-emitting diode packaging structure
  • Manufacturing method of light-emitting diode packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Such as figure 1 As shown, this embodiment discloses a method for manufacturing a light emitting diode packaging structure, including the following process steps:

[0040] (1) if Figure 4 As shown, a glass substrate is provided as the carrier substrate 101, and a layer of tape film is pasted on the glass substrate. Double-sided tape film or thermal separation tape film can be selected to form an adhesive surface 102 on the glass substrate. A number of flip-chip LED chips 103 are distributed on the surface, so that the chip electrodes face up, the light-emitting surface of the chips faces down and are fixed on the tape film;

[0041] (2) if Figure 5 As shown, a layer of transparent glue 104 is coated around the flip-chip LED chip 103. Optionally, the transparent glue may contain phosphor;

[0042] (3) if Image 6 As shown, the flexible mold 105 is evacuated and adsorbed on the hard mold 1051 with an inverted concave shape. The choice of the flexible mold is prefera...

Embodiment 2

[0049] Such as Figure 11 As shown, compared with Embodiment 1, the carrier substrate 101 of Embodiment 1 has a flat structure, while the carrier substrate 101 of this embodiment has a concave-convex structure. Define the upper surface of the carrier substrate where the LED chips are distributed as the functional area, and the other upper surfaces as the non-functional area, then the functional area is "raised", and the non-functional area forms a "depression", that is, the functional area is higher than the non-functional area.

[0050] Such as Figure 12 As shown, the transparent glue 104 is coated on the periphery of the above-mentioned LED chip, that is, the non-functional area, so that the non-functional area can be used as a glue storage tank, which is beneficial to the fluidity of the transparent glue between adjacent CSP LED packaging structures.

[0051] Such as Figure 13 As shown, after the transparent glue in the non-functional area of ​​the flat carrier substrat...

Embodiment 3

[0053] The difference from Example 1 is that the adhesive surface of the carrier substrate in Example 1 is formed by inserting a double-sided tape film, while the adhesive surface of the carrier substrate in this embodiment is formed by a surface modification process. Optionally, the adhesive surface can also be formed by Coating the viscous material to form.

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Abstract

A method for manufacturing a light-emitting diode package structure comprises the processing steps of: providing a carrier substrate (101) having a viscous surface (102); distributing an LED chip (103) on the viscous surface such that a light-emitting surface of the LED chip faces the viscous surface; forming a transparent adhesive (104) around the LED chip; molding the transparent adhesive using a flexible mold (105) by pressing such that the surface of the transparent adhesive forms an inclined plane or a curved surface.

Description

technical field [0001] The invention relates to an LED package, in particular to a method for manufacturing a chip-level light-emitting diode package structure. Background technique [0002] The traditional LED packaging structure consists of die bonding, wire bonding, and fluorescent glue sealing on a metal bracket. Recently, chip-scale package LED (Chip Scale Package LED, referred to as CSP LED) based on flip-chip is very popular. It has electrodes on the bottom of the chip, and directly encapsulates the colloid on the upper surface and side of the chip, so that the bottom surface The electrodes are exposed. Since this packaging structure has no support or substrate, the packaging cost can be reduced. This packaging form does not use a substrate or wire bonding. It can be directly covered with fluorescent glue on the chip and then cut. Existing chip-scale packaged LEDs usually emit light from five sides, that is, both the top surface and the four sides of the LED can emit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/52H01L33/50H01L33/60H01L33/00
CPCH01L33/005H01L33/501H01L33/502H01L33/52H01L33/60H01L33/48
Inventor 林秋霞林振端时军朋徐宸科赵志伟
Owner QUANZHOU SANAN SEMICON TECH CO LTD