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Method for producing copper particles, copper particles and copper paste

A manufacturing method and technology of copper particles, which are applied in manufacturing tools, cable/conductor manufacturing, transportation and packaging, etc., can solve problems such as difficulty in use and expensive silver, and achieve the effect of improving connection strength

Active Publication Date: 2017-11-28
OSAKA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Also, silver is expensive and difficult to use in industry

Method used

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  • Method for producing copper particles, copper particles and copper paste
  • Method for producing copper particles, copper particles and copper paste
  • Method for producing copper particles, copper particles and copper paste

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Embodiment Construction

[0045] Embodiments of the present invention will be described below. However, the present invention is not limited to the following embodiments in any way. The present invention can also be carried out by making appropriate changes within the scope of the purpose of the present invention. In addition, overlapping explanations may be appropriately omitted, but this does not limit the gist of the invention.

[0046] The embodiment of the present invention relates to a method for manufacturing copper particles. The manufacturing method of this embodiment includes a preparation step and a heating step. In the heating step, the mixture of the copper compound, the main group metal salt and the polyhydric alcohol is heated. Thereby, the particle diameter and shape of the obtained copper particle can be controlled easily. The reason for this is presumed as follows.

[0047] For convenience of explanation, the case where ethylene glycol is used as the polyhydric alcohol and the di...

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Abstract

This method for producing copper particles comprises a preparation step and a heating step. In the preparation step, a copper compound, a salt of a typical metal element and a polyhydric alcohol are prepared. In the heating step, a mixture of the copper compound, the salt of a typical metal element and the polyhydric alcohol is heated. It is preferable that the typical metal element is one or more elements selected from the group consisting of lithium, beryllium, sodium, magnesium, aluminum, potassium, calcium, zinc, gallium, germanium, rubidium, strontium, cadmium, indium, tin, antimony, cesium and barium.

Description

technical field [0001] The invention relates to a method for manufacturing copper particles, copper particles and copper paste. Background technique [0002] It is known that silver paste can be used as a wiring material and a connecting material of electronic components. Silver paste is a paste in which conductive silver particles are dispersed in an organic solvent. However, silver easily causes ion migration phenomenon. The ion migration phenomenon refers to a phenomenon in which a part of metal wired on an insulating material moves on the insulating material to cause a short circuit in the wiring. Also, silver is expensive and difficult to use in industry. [0003] Therefore, studies have been made on wiring materials and connection materials that can replace silver paste. For example, the use of copper paste has been studied. The copper particles contained in the copper paste have a resistivity comparable to that of silver particles, and are less likely to cause io...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24B22F1/00H01B1/00H01B1/22H01B5/00H01B13/00B22F1/052
CPCH01B1/22H01B1/02B22F9/24B23K35/025B23K35/302B22F1/052B22F1/00H01B5/00H01B13/00B22F2301/10
Inventor 菅沼克昭酒金婷
Owner OSAKA UNIV
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