Planting method for improving quality of corn

A planting method and corn technology, applied in the fields of botanical equipment and methods, seed coating/seed dressing, horticultural methods, etc., can solve the problems of easy occurrence of diseases and insect pests, low survival rate, affecting quality, etc., and reduce corn drug use. damage, sufficient photosynthesis, and the effect of improving quality and yield

Inactive Publication Date: 2017-12-01
黄勇
View PDF6 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the survival rate of corn planting is not high, and it

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A planting method for improving corn quality, comprising the following steps:

[0040] (1) Site selection and land preparation

[0041] Choose fertile, deep, loose, and well-drained soil as the planting site. Remove the root stubble in time after the harvest of the previous crop, and plow 20 cm deep to make the soil finely divided, the soil soft, the ground flat, and the cultivated layer solid;

[0042] (2), selection

[0043] Select grains with plump grains, consistent size, no diseased grains and complete germs as corn seeds;

[0044] (3), seed treatment

[0045] Seed treatment: Soak the corn seeds with paclobutrazol solution 10 days before sowing, take them out and drain, put the corn seeds into the coating machine, and use the corn coating agent to coat the seeds to form a uniform film on the outer layer of the corn seeds. The film is ready for sowing after curing;

[0046] (4), sowing

[0047] Sow the corn seeds, sow in rows, and the row spacing is configured ...

Embodiment 2

[0066] A planting method for improving corn quality, comprising the following steps:

[0067] (1) Site selection and land preparation

[0068] Choose fertile, deep, loose, and well-drained soil as the planting site. Remove the root stubble in time after the harvest of the previous crop, and plow 30 cm deep to make the soil finely divided, the soil soft, the ground flat, and the cultivated layer solid;

[0069] (2), selection

[0070] Select grains with plump grains, consistent size, no diseased grains and complete germs as corn seeds;

[0071] (3), seed treatment

[0072] Seed treatment: Soak corn seeds with paclobutrazol solution 13 days before sowing, take out and drain, put the corn seeds into a coating machine, and coat the seeds with a corn coating agent to form a uniform film on the outer layer of the corn seeds. The film is ready for sowing after curing;

[0073] (4), sowing

[0074] Sow the corn seeds, sow in rows, and the row spacing is configured with wide and n...

Embodiment 3

[0093] A planting method for improving corn quality, comprising the following steps:

[0094] (1) Site selection and land preparation

[0095] Choose fertile, deep, loose, and well-drained soil as the planting site. Remove the root stubble in time after the previous crop is harvested, and plow 25 cm deep to make the soil finely divided, the soil soft, the ground flat, and the cultivated layer solid;

[0096] (2), selection

[0097] Select grains with plump grains, consistent size, no diseased grains and complete germs as corn seeds;

[0098] (3), seed treatment

[0099] Seed treatment: Soak corn seeds with paclobutrazol solution 12 days before sowing, take out and drain, put the corn seeds into the coating machine, and coat the seeds with corn coating agent to form a uniform film on the outer layer of the corn seeds. The film is ready for sowing after curing;

[0100] (4), sowing

[0101] The corn seeds are sown in rows, and the row spacing is configured with wide rows an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a planting method for improving the quality of corn, and relates to the technical field of corn planting. The planting method comprises the following steps of land selection and preparation, seed selection, seed treatment, sowing, film mulching, field management and harvesting. By means of the planting method, the survive rate of the corn can be improved, plant diseases and insect pests can be reduced, and the overall quality is improved.

Description

technical field [0001] The invention relates to the technical field of corn planting, in particular to a planting method for improving the quality of corn. Background technique [0002] Corn is an important crop and food in our country. Corn is rich in nutrition, and its "all-around nutrition" is suitable for people of all ages. Its rich glutamic acid can promote brain development, and it is the best "educational food" for children; The vitamin B complex contained in it can regulate the nerves, and is a "decompression food" suitable for white-collar workers; rich in linoleic acid and calcium, which can help regulate fat and lower blood pressure, and the high fiber content makes corn a good "scraping intestines". "Food" can prevent middle-aged obesity; in addition, the glutathione rich in corn is the most effective anti-cancer ingredient, and the rich vitamin E it contains can also help anti-aging and soften blood vessels. At present, the survival rate of corn is not high wh...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): A01G1/00A01G7/06A01G13/02A01C1/00A01C1/06A01M1/02A01M1/04C05G1/00
CPCA01G7/06A01C1/00A01C1/06A01G13/0275A01G22/00A01M1/02A01M1/04C05B7/00C05C9/00C05D1/00C05D3/00C05D5/00C05D9/02C05F3/00C05F5/00C05F5/002C05F5/006C05F11/02C05D9/00C05F11/00
Inventor 黄勇
Owner 黄勇
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products