Semiconductor memory device

A memory and semiconductor technology, applied in static memory, digital memory information, information storage, etc., can solve problems such as increased difficulty in wiring

Inactive Publication Date: 2017-12-08
WINBOND ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, as the area of ​​area A shrinks, if the original control circuit is to be completely routed (layout) to area A, the difficulty of layout will also increase accordingly.

Method used

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  • Semiconductor memory device
  • Semiconductor memory device
  • Semiconductor memory device

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Embodiment Construction

[0052] What is described in this chapter is the best way to implement the present invention. The purpose is to illustrate the spirit of the present invention rather than to limit the protection scope of the present invention. The protection scope of the present invention should be determined by the claims. In order to make the features and advantages of the present invention more comprehensible, preferred embodiments thereof are specifically cited below and described in detail with accompanying drawings.

[0053] image 3 is a block diagram of a semiconductor memory device 300 according to an embodiment of the present invention. The semiconductor memory device 300 includes a plurality of memory arrays 310-1...310-N, word line driving circuits 320-1...320-N, and a plurality of sense amplifier circuits 330-1...330-N, wherein N is a positive integer. In the embodiment of the present invention, in image 3 The transistors included in the control circuit included in each region ...

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Abstract

The invention provides a semiconductor memory device. The device includes a plurality of memory arrays, a plurality of word line driving circuits and a plurality of sensing amplifying circuits. The plurality of word line driving circuits are respectively disposed between the above-mentioned plurality of memory arrays in a first direction which is parallel to the above-mentioned plurality of memory arrays, and each thereof is connected with one of the above-mentioned plurality of memory arrays in a coupled manner. The plurality of sensing amplifying circuits are respectively disposed between the above-mentioned plurality of memory arrays in a second direction which is parallel to the above-mentioned plurality of memory arrays, and each thereof is connected with one of the above-mentioned plurality of memory arrays in the coupled manner. A region between the word line driving circuit and the sensing amplifying circuit corresponding to each of the plurality of memory arrays includes a plurality of control circuits. All transistors included by the above-mentioned plurality of control circuits are NMOS transistors. According to the device, the intersection region between the word line driving circuit and the sensing amplifying circuit can be enabled to achieve more efficient use.

Description

technical field [0001] The present invention relates to a semiconductor memory, in particular to a semiconductor memory in which the control circuit arranged in the intersecting area of ​​the word line driver circuit and the sense amplifier circuit is composed of NMOS transistors. Background technique [0002] The semiconductor memory is an integrated circuit (Integrated Circuit, IC) made of a silicon (Si) chip. Semiconductor memory devices are mainly classified into two types, volatile memory devices and nonvolatile memory devices. A volatile memory device is a memory device that loses stored data when power is interrupted. Volatile memory devices include, for example, Static Random Access Memory (SRAM), Dynamic Random Access Memory (Dynamic Random Access Memory, DRAM), and Synchronous Dynamic Random Access Memory (Synchronous DRAM, SDRAM). A non-volatile memory device is a memory device that retains stored data even when power is interrupted. Non-volatile memory devices...

Claims

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Application Information

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IPC IPC(8): G11C8/08G11C8/14
CPCG11C8/08G11C8/14
Inventor 张昆辉
Owner WINBOND ELECTRONICS CORP
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