A kind of preparation method of graphite, copper composite heat-conducting material

Abstract

The present application relates to a preparation method for a graphite and copper composite heat conduction material. The method comprises: carrying out electrocoppering on a surface of an artificial graphite film so as to obtain a graphite and copper composite heat conduction material. According to the present application, compositing of an artificial graphite material and copper can be realized by using an electroplating method; compared with a "laminating" mode in the related art, the copper forms a coating with a thickness of only 3-10 μm on the surface of the graphite film, the combination of the copper and the graphite film can be more compact, and the copper and the graphite film are difficult to separate and fall off; moreover, in the present application, the surface point-like defects can be reduced, and the shrinkage rate in an original film processing process can be decreased; the obtained graphite and copper composite heat conduction material has good heat conduction performance, the heat conduction coefficient in the Z-axis direction can reach 300 W / MK or higher, and the heat conduction coefficients in the X-axis direction and the Y-axis direction are 800W / MK or higher. According to the present application, the production process is reduced, and therefore the labor costs and the equipment costs can be greatly lowered, and the preparation method is suitable for industrial production and has good economic benefits and a wide application prospect.

Description

technical field [0001] The invention relates to the field of preparation of heat-conducting materials, in particular to a method for preparing graphite-copper composite heat-conducting materials. Background technique [0002] With the development of electronic products, users require high performance of electronic products, and the power of various electronic product components is getting higher and higher, so higher requirements are put forward for the heat dissipation performance of materials. The heat conduction products used in existing electronic products include artificial graphite with X-Y axis thermal conductivity of 800-2000W / (m K), but Z-axis thermal conductivity of only 15W / (m K) or less, and XYZ direction thermal conductivity Both are not very high copper and aluminum products, and their thermal conductivity is only 300-400W / (m·K). With the development of science and technology, these two types of products can no longer meet the needs of users for heat dissipati...

AI Technical Summary

Problems solved by technology

[0003] (1) Nowadays, electronic products are getting thinner and thinner, and the combined use thickness can no longer meet the space requirements of electronic products (the space given by users is basically between 50μm-100μm);

[0004] (2) The combination of low-performance heat-conducting products (copper, aluminum, etc.) and products with high heat-conducting in a single XY direction (artificial graphite) are all bonded with self-adhesive, which is easy to overflow in the environment where electronic products are used. Easy to cause delamination;

[0005] (3) The combination of low-performance heat conduction products (copper, aluminum, etc.) and single XY high heat conduction products (artificial graphite) in the production process is due to the need to fit each other, waste materials, increase man-hours, and increase product production costs.

[0009] The above methods have improved the mechanical properties and heat dissipation effect of copper and graphite composite materials to a certain extent, but the degree of improvement is still insufficient, and new methods need to be developed to improve the thermal conductivity of materials in the XYZ direction