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Method for designing and manufacturing semiconductor device and corresponding semiconductor device

A semiconductor and device technology, applied in the field of designing and manufacturing semiconductor devices and corresponding semiconductor devices, can solve problems such as unpredictability, signal crosstalk, and signal transmission deterioration.

Active Publication Date: 2021-03-19
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However this may degrade the signal transmission and the signal may become more susceptible to crosstalk from other lines due to the changed conductor path
This can even worsen timing violations
Furthermore, this is a process that is difficult to automate or perform primarily with computer assistance, and may and / or require manual intervention and often multiple iterations, making it difficult to predict when the circuit design will actually be completed

Method used

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  • Method for designing and manufacturing semiconductor device and corresponding semiconductor device
  • Method for designing and manufacturing semiconductor device and corresponding semiconductor device
  • Method for designing and manufacturing semiconductor device and corresponding semiconductor device

Examples

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Embodiment Construction

[0016] Different embodiments are described in detail below. These examples are illustrative only and are not intended to be limiting. In particular, the description of an embodiment having a plurality of features, components or procedures should not be construed as implying that all such features, components or procedures are necessary to implement. Rather, in other embodiments certain features, components or processes may be omitted and / or replaced by alternative features, components or processes. Features, components or procedures of different embodiments may be combined with each other unless otherwise specified. Variations, modifications and details thereof described for one of the embodiments also apply to the other embodiments.

[0017] In the description of the following embodiments, reference is made, in part, to front end of line (FEOL) processes and structures and back end of line (BEOL) processes and structures. As stated at the outset, the FEOL includes all proc...

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PUM

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Abstract

The present invention proposes a method for designing a semiconductor device, a method for manufacturing a semiconductor device, and a corresponding semiconductor device. In this case, the capacitive structure is either coupled to the supply network or used to eliminate design violations.

Description

technical field [0001] The present application relates to a method for designing, ie drafting, a semiconductor device and a corresponding computer program, and also to a method for manufacturing a semiconductor device and a correspondingly manufactured semiconductor device. In particular, the present application relates to methods and semiconductor devices in which timing violations in digital circuit paths can be corrected at a relatively late stage. Background technique [0002] There are also often design violations late in the chip design cycle that must be corrected before a semiconductor device, such as a semiconductor chip with an integrated circuit, can be produced. Such design violations may in particular be timing violations such as setup violations and hold violations. [0003] The manufacture of semiconductor components requires different masks in these process steps, by means of which the structures to be produced are defined. Semiconductor manufacturing proce...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/398H01L21/822H01L27/02
CPCH01L21/822H01L27/0207G06F30/398H01L23/5223H01L29/94G06F30/392H01L23/5222H01L29/0619H01L29/1608H01L29/43H01L29/6606H01L29/861
Inventor A·屈泽尔
Owner INFINEON TECH AG
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