Microwave device circuit coupling transmission performance testing method taking double gold bonding wire mutual induction into account

A technology of gold wire bonding and microwave devices, which is applied in instruments, special data processing applications, electrical digital data processing, etc., and can solve problems such as the coupling relationship between double gold wire bonding wires and microwave devices.

Active Publication Date: 2017-12-15
XIDIAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, currently, for the analysis of the influence mechanism of the double gold wire bonding interconnection process, engineers rely more on empirical data for circuit structure design

Method used

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  • Microwave device circuit coupling transmission performance testing method taking double gold bonding wire mutual induction into account
  • Microwave device circuit coupling transmission performance testing method taking double gold bonding wire mutual induction into account
  • Microwave device circuit coupling transmission performance testing method taking double gold bonding wire mutual induction into account

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Embodiment Construction

[0108] The invention will be further described in detail below in conjunction with the accompanying drawings and embodiments, but it is not used as a basis for any limitation on the invention.

[0109] refer to figure 1 , the present invention is a method for predicting the coupling transmission performance of microwave devices considering the mutual inductance of two gold wire bonding wires. The specific steps are as follows:

[0110] Step 1, determine the structural parameters, electromagnetic parameters and material properties of the double gold wire bonding wire

[0111] Structural parameters under double gold wire bonding in microwave devices, including gold wire span D, gold wire spacing s, gold wire diameter d, gold wire arch height h, angle between gold wire and dielectric substrate The material properties of the two gold wire bonding wires in the microwave device include the resistivity ρ of the gold wire, the relative magnetic permeability μ of the gold wire r ; T...

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Abstract

The invention discloses a microwave device circuit coupling transmission performance testing method taking double gold bonding wire mutual induction into account. The method includes the steps that structural parameters, electromagnetic parameters and material attributes of double gold bonding wires are determined; the ith gold bonding wire is equivalent to a resistor and an inductor, and welded discs are equivalent to two plane-parallel capacitors; an equivalent two-port network form between the ith bonding wire and the welded dics at the two ends of the ith bonding wire is determined; the wire length and the skin depth are calculated; a serial resistor Ri, an inductance value, a mutual inductance value, a serial inductor Li, an electrode plate interval and a parallel capacitor Ci which are in the network are determined; whether or not the double gold bonding wires are equivalent to the welded discs at the two ends of the double gold bonding wires is judged; under the double gold bonding wires, the equivalent two-port network form, an equivalent impedor, a serial resistor R, a serial inductor L, a parallel capacitor C and open-circuit impedance parameters are determined; microwave device transmission parameters are calculated; a coupling model is established; the microwave device transmission performance is calculated under the double gold bonding wires. The microwave device circuit coupling transmission performance testing method taking the double gold bonding wire mutual induction into account achieves the purpose that the microwave device transmission performance is rapidly predicted and analyzed under the different structural parameters of the double gold bonding wires.

Description

technical field [0001] The invention belongs to the technical field of microwave radio frequency circuits, and in particular relates to a method for predicting the coupling transmission performance of a microwave device circuit considering the mutual inductance of two gold wire bonding wires. Background technique [0002] With the development of information electronics technology, microwave devices such as millimeter wave and micron wave are widely used in communication, radar, aerospace, navigation and other fields. With the development of electronic components becoming increasingly dense, integrated and miniaturized, this puts forward more stringent requirements for the assembly process of microwave devices, and the signal transmission between microwave devices is mainly realized by gold wire bonding. , so the structural parameters of gold wire bonding will directly affect the transmission performance of microwave signals. [0003] Different from the interconnection wires...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/20G06F30/398
Inventor 王从思李锦涛程景胜张洁连培园彭雪林李明荣王志海訾斌段宝岩
Owner XIDIAN UNIV
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