Full-automatic AOI particle indentation detection machine

Abstract

The invention discloses a full-automatic AOI particle indentation detection machine. The detection machine comprises a particle indentation detection unit which detects an LCM bound with an IC, and an independent IC corner-chipping edge-chipping detection camera (8) is arranged on the particle indentation detection unit in a matched mode; the particle indentation detection unit is used for conducting indentation detection on the LCM, an FPC detects a certain period of interval time in the process of IC detection, the IC corner-chipping edge-chipping detection camera (8) which is arranged on a blanking conveying arm (6) is moved to the portion above the LMC and takes a picture of the IC, an image is acquired and processed, and whether or not corner-chipping and edge-chipping exits in the IC which is bound on the LMC is judged. According to the full-automatic AOI particle indentation detection machine, when the particle indentation detection unit conducts indentation detection on the LMC, the detection of corner-chipping and edge-chipping of the IC which is bound on the LMC can be completed, compared with the manual sampling, the cost is lowered, the qualification rate is improved, the unnecessary cost waste is avoided, and the production benefit is improved.

Description

technical field [0001] The invention relates to the field of AOI particle indentation detection, and more specifically, relates to a chipping detection mechanism for an IC bound on an LCM. Background technique [0002] With the development of technology, rough and cumbersome working methods are gradually replaced by precise and fast working methods, and the degree of machine automation is getting higher and higher. With the development of this trend, the requirements for production efficiency, continuity and product qualification rate are getting higher and higher. [0003] AOI is automatic optical inspection, which uses rich and dedicated multi-functional inspection algorithms and binary or gray level optical imaging processing technology for inspection. The product LCM detected by the present invention is an LCD display module, which is composed of liquid crystal display LCD, integrated chip IC, flexible circuit board FPC and other components. The structure of the LCD is...

AI Technical Summary

Problems solved by technology

During the production process of IC cutting or COG bonding, IC chipping or edge chipping will be caused, which leads to screen manufacturers needing to detect IC chipping corners and edge chipping

[0004] The traditional particle indentation inspection machine can only detect LCM indentation, while the IC chipping and edge chipping inspection of LCM is measured one by one manually under an expensive microscope that can measure the size, which is extremely low in efficiency and poor in reliability.

[0005] Since manual inspection needs to be observed and inspected under a microscope, it takes a long time to inspect a piece of glass, so it can only be inspected by random inspection, which is difficult to ensure a 100% pass rate of finished products in the production line, resulting in labor waste for manufacturers and product pass-through rates. decline, resulting in increased production costs and lower profits

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