Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Robot teaching method and robot

A teaching method and robot technology, applied in the direction of robots, instruments, manipulators, etc., can solve the problem of not being able to specify the position of the image sensor beam direction, and achieve the effect of improving the teaching accuracy

Active Publication Date: 2020-07-31
KAWASAKI HEAVY IND LTD +1
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the position in the beam direction of the image sensor cannot be specified

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Robot teaching method and robot
  • Robot teaching method and robot
  • Robot teaching method and robot

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] (first embodiment)

[0037] Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. Hereinafter, the same reference numerals are attached to the same or corresponding elements in all the drawings, and repeated explanations are omitted.

[0038] figure 1 It is a schematic diagram showing the structure of the robot 1 of the first embodiment. Such as figure 1 As shown, the robot 1 is used, for example, to transport a substrate W such as a wafer, which is a material of a semiconductor package, in a semiconductor processing facility for manufacturing a semiconductor package. Wafers include semiconductor wafers and glass wafers. Semiconductor wafers include, for example, silicon wafers, wafers of other semiconductor monomers, and wafers of compound semiconductors. Glass wafers include, for example, glass substrates for FPDs, glass substrates for MEMS, and sapphire (single crystal alumina) wafers. A semiconductor process...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The teaching method of the robot includes the following steps: a swinging step, which makes the hand swing around a prescribed rotation axis on an axis perpendicular to the optical axis of the sensing beam, so as to scan the target in the horizontal direction with the sensing beam; the determination step , according to the detection signal of the image sensor (12) that changes by making the hand swing, it is determined whether the target is consistent with the position of the central axis along the length direction of the hand; The shift amount of the hand is calculated from the detection signal of the image sensor which changes according to the swing, and the hand is shifted in either left or right direction along the optical axis of the sensing beam according to the calculated shift amount.

Description

technical field [0001] The invention relates to a robot teaching method and the robot. Background technique [0002] In general, when transporting semiconductor wafers, glass substrates for display panels, etc. in semiconductor processing equipment, a horizontal articulated transfer robot with a link system is used. In some cases, a mapping sensor (mapping sensor) is provided at the tip of the hand of the transfer robot. The image sensor is used to detect whether the substrate is stored in the cassette. For example, the image sensor is configured such that the sensing light beam advances linearly in the space between the first and second tips of the bifurcated hand. Generally speaking, when an image sensor is used to detect an object, the detection position is the position where the object blocks the sensing beam. Therefore, the position in the beam direction of the image sensor cannot be specified. As a prior art, U.S. Patent No. 752,267 discloses a technique for calcul...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B25J9/06B25J15/08
CPCB25J9/1612G05B2219/37415G05B2219/39536G05B2219/45057Y10S901/47Y10S901/03B25J9/163B25J9/1697H01L21/67259H01L21/681
Inventor 中矢敦史山口隆生中原一陈甘源
Owner KAWASAKI HEAVY IND LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products