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Measuring device and method for improving plating uniformity analysis efficiency

A technology of measuring device and analysis efficiency, applied in electromagnetic measuring device, electric/magnetic thickness measurement, etc., can solve the problems of low work efficiency, inaccurate detection and analysis, etc., to improve accuracy, improve detection and analysis efficiency, and achieve reasonable distribution. Effect

Inactive Publication Date: 2018-01-09
JIANGMEN SUNTAK CIRCUIT TECH
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Problems solved by technology

[0007] Aiming at the problems of low work efficiency and inaccurate detection and analysis in the existing electroplating copper surface uniformity analysis device and method, the present invention provides a measurement device and method for improving the efficiency of electroplating uniformity analysis. Using the measurement device can not only improve the The analysis efficiency of circuit board electroplating uniformity, and greatly improved the accuracy of electroplating copper thickness uniformity analysis results

Method used

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  • Measuring device and method for improving plating uniformity analysis efficiency
  • Measuring device and method for improving plating uniformity analysis efficiency
  • Measuring device and method for improving plating uniformity analysis efficiency

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Embodiment

[0027] The production process of circuit boards generally includes core board cutting → negative film making inner layer circuit → pressing to make production board → drilling → sinking copper → full board electroplating → positive film process to make outer layer circuit → making solder mask → surface treatment → Molding makes the circuit board.

[0028] The copper thickness uniformity of copper plating on the production board in the whole board electroplating process is one of the important factors that cannot be ignored in the influencing factors of fine circuit board etching. The detection and analysis of uniformity, but the quality of the measurement points on the surface of the production board determines the correctness of the analysis of the uniformity of copper thickness.

[0029] Such as Figure 1 to Figure 3 As shown, the copper ball used for electroplating is the positive pole, and the board surface is the negative pole. Generally, when the production board is ele...

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Abstract

The invention discloses a measuring device and method for improving the plating uniformity analysis efficiency. The measuring device is a flat plate which is of the same size as a plate to be measured. Through holes are arranged in the flat plate along the long side direction of the flat plate and in length positions as follows: 1 / 64, 1 / 32, 1 / 16, 1 / 8, 1 / 4, 1 / 2, 3 / 4, 7 / 8, 15 / 16, 31 / 32, and 63 / 64. The through holes of the measuring device are set according to the electric field distribution during whole-plating of the plate to be measured. By using the measuring device, the analysis efficiency of the electroplating uniformity of a circuit board can be improved, and the accuracy of the electroplating copper thickness uniformity analysis result can be greatly improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a measuring device and method for improving the analysis efficiency of electroplating uniformity. Background technique [0002] With the development of circuit boards towards light, thin, short, and small, the requirements for line width and spacing of circuit boards are getting smaller and smaller, and the requirements for circuit precision are also getting higher and higher. When the thickness of electroplated copper is uneven, it will cause Copper surfaces with different thicknesses produce different etching states in the same etching time, resulting in over-etching or insufficient spacing of the lines. The uniformity of copper thickness of the full-plate copper plating is one of the important factors that cannot be ignored in the influencing factors of fine circuit board etching. First, this requires that after the entire board is electroplated, the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B7/06
Inventor 钟宇玲敖四超寻瑞平张华勇
Owner JIANGMEN SUNTAK CIRCUIT TECH
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