Measuring device and method for improving plating uniformity analysis efficiency

A technology of measuring device and analysis efficiency, applied in electromagnetic measuring device, electric/magnetic thickness measurement, etc., can solve the problems of low work efficiency, inaccurate detection and analysis, etc., to improve accuracy, improve detection and analysis efficiency, and achieve reasonable distribution. Effect
CN107560533AInactive Publication Date: 2018-01-09JIANGMEN SUNTAK CIRCUIT TECH
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
JIANGMEN SUNTAK CIRCUIT TECH
Publication Date
2018-01-09
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention discloses a measuring device and method for improving the plating uniformity analysis efficiency. The measuring device is a flat plate which is of the same size as a plate to be measured. Through holes are arranged in the flat plate along the long side direction of the flat plate and in length positions as follows: 1 / 64, 1 / 32, 1 / 16, 1 / 8, 1 / 4, 1 / 2, 3 / 4, 7 / 8, 15 / 16, 31 / 32, and 63 / 64. The through holes of the measuring device are set according to the electric field distribution during whole-plating of the plate to be measured. By using the measuring device, the analysis efficiency of the electroplating uniformity of a circuit board can be improved, and the accuracy of the electroplating copper thickness uniformity analysis result can be greatly improved.
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Description

technical field

[0001] The invention relates to the technical field of printed circuit board production, in particular to a measuring device and method for improving the analysis efficiency of electroplating uniformity. Background technique

[0002] With the development of circuit boards towards light, thin, short, and small, the requirements for line width and spacing of circuit boards are getting smaller and smaller, and the requirements for circuit precision are also getting higher and higher. When the thickness of electroplated copper is uneven, it will cause Copper surfaces with different thicknesses produce different etching states in the same etching time, resulting in over-etching or insufficient spacing of the lines. The uniformity of copper thickness of the full-plate copper plating is one of the important factors that cannot be ignored in the influencing factors of fine circuit board etching. First, this requires that after the entire board is electroplated, the c...

Claims

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