Double-sided conduction structure processing method, linear circuit board processing method and line light source

Abstract

The invention provides a processing method for a linear circuit board, which includes providing an insulating base material; providing a first conductive layer and a third conductive layer that are insulated from each other on the same side surface of the insulating base material; and providing a second conductive layer, Provided on the other side surface of the insulating base material, the edge of the second conductive layer is retracted from the edge of the same side of the first conductive layer and forms a step; solder is provided, and a printing welding process is used to electrically connect the second conductive layer. a conductive layer and the second conductive layer. The linear circuit board of the invention has simple process and high product reliability. At the same time, the invention also provides a processing method of a double-sided conductive structure and a linear light source using the linear circuit board processing method.

Description

technical field [0001] The invention relates to the printed circuit board industry, in particular to a method for processing a double-sided conduction structure of a printed circuit board, a method for processing a linear circuit board, and a line light source using the method for processing the linear circuit board. Background technique [0002] With the development of modern electronic technology, electronic products have gradually penetrated into people's lives. All kinds of electronic products require printed circuit boards to realize the layout and logical connection of various electronic devices. [0003] In the prior art, the flexible printed circuit board usually adopts the way of through-hole conduction, that is, the drilling process is used to set the through-hole in the substrate, and a conductive layer is set in the through-hole, and then an ink plug is provided to continue the subsequent electroplating. , etching and other processes. [0004] However, the above...

AI Technical Summary

Problems solved by technology

[0005] First of all, because flexible printed circuit boards are becoming thinner and thinner in order to achieve flexibility, it is difficult to implement double-sided electrical connections by setting through holes in flexible printed circuit boards, and the yield rate is low and the cost is high;

[0006] Secondly, for linear printed circuit boards, due to the voltage drop loss of the device itself and the voltage drop caused by the conductive line transmission, the driving voltage of some electronic devices cannot reach the standard voltage, which causes the loss of electronic devices and reduces the overall reliability of the product.

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