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Composite shock absorber with sacrifice structure

A shock absorber and shock pad technology, applied in the field of vibration damping structures, can solve the problems of inability to guarantee the survivability of high-precision MEMS devices, low overload resistance performance of high-precision MEMS devices, and achieve the effect of light weight and small volume

Active Publication Date: 2018-01-12
BEIJING MXTRONICS CORP +1
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Problems solved by technology

[0003] Since MEMS devices are mechanically sensitive devices, the vibration and overload of the carrying platform during launch / flight have a significant impact on the inertial measurement accuracy and even survival of MEMS-based IMUs, and the overload resistance performance of high-precision MEMS devices is generally not high. Existing The shock absorption scheme cannot guarantee the survivability of high-precision MEMS devices under high overload conditions

Method used

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  • Composite shock absorber with sacrifice structure
  • Composite shock absorber with sacrifice structure
  • Composite shock absorber with sacrifice structure

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Embodiment Construction

[0034] The present invention proposes a composite shock absorber with a sacrificial structure, which consists of an upper shell 1, a lower shell 2, a shock absorber 3, a shock pad 4, and a sacrificial structure 5, wherein the shock pad 4 is directly molded on the The shock-absorbing support 3 provides physical protection for the internal functional parts in the working environment, so that the entire assembly can be integrated during transmission, transportation and use. The invention has the characteristics of small size, easy assembly, light weight, high mechanical strength and high overload resistance.

[0035] It is generally believed that the overload of random vibration is less than 5000G, the frequency is 10Hz-2000Hz, and the approximate half-sine width is less than 1ms. The shock-absorbing pad 4 mainly isolates this type of vibration, and it is necessary to ensure that the angular deviation of the shock-absorbing bracket 3 is not greater than 0.05 during the vibration p...

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Abstract

The invention relates to a composite shock absorber structure with a sacrifice structure. The composite shock absorber structure with the sacrifice structure is characterized by comprising a shell structure, a shock absorbing support and the sacrifice structure; the shock absorbing support is arranged in the shell structure, and is used for supporting a protected assembly; the sacrifice structureis arranged between the bottom end of the protected assembly and the shell structure; and after bearing the axial high impacting overload, the sacrifice structure generates plastic deformation. The shock absorber structure has the beneficial effects of being small in size and small in weight, has the filtering capacity on random vibration such as a common shock absorber, also has certain one-timesuper-high overload protecting cavity, and is mainly applicable to application of mechanical sensitive systems on a missile-borne IMU or other missile-borne platforms.

Description

technical field [0001] The invention relates to a composite shock absorber with a sacrificial structure, belonging to the technical field of shock absorbing structures. Background technique [0002] The IMU (Inertial Measurement Unit) module is the inertial measurement unit, which is mainly used to collect attitude information, convert it into data, provide it to the processor of the total system, complete the attitude calculation, and cooperate with satellite navigation to form an integrated navigation system. The sensors in the IMU mainly include For angular rate sensor, acceleration sensor, magnetic force sensor, air pressure sensor, etc. [0003] Since MEMS devices are mechanically sensitive devices, the vibration and overload of the carrying platform during launch / flight have a significant impact on the inertial measurement accuracy and even survival of MEMS-based IMUs, and the overload resistance performance of high-precision MEMS devices is generally not high. Existin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16F15/08F16F15/02
Inventor 周博远柴宏玉康苗苗王恪良
Owner BEIJING MXTRONICS CORP
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