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Interface line of QSFP small package with four channels

A small package, four-channel technology, used in plastic/resin/wax insulators, organic insulators, conductors, etc., can solve the problems of high and low temperature shock resistance, large dielectric constant, poor flame retardancy, etc., and achieve insulation flame retardancy. High, signal attenuation loss is reduced, the effect of reducing the dielectric constant

Inactive Publication Date: 2018-01-12
DONGGUAN KINGSIGNAL ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the insulating layer of the QSFP four-channel small package interface line is a PE insulating layer, which has insufficient strength and a large dielectric constant, resulting in high attenuation, return loss, differential to common mode signal loss, and poor flame retardancy. , not resistant to high and low temperature impact

Method used

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  • Interface line of QSFP small package with four channels
  • Interface line of QSFP small package with four channels

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Embodiment Construction

[0020] The structural principle and working principle of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0021] Such as figure 1 and figure 2 As shown, the present invention is a QSFP four-channel small package interface wire, including an eight-strand wire core group 1, a first shielding layer 2 wrapped outside the eight-strand wire core group 1, and a first shielding layer outside the first shielding layer. Outer jacket 3, each of the core groups 1 includes two core wires 11, a second shielding layer 12 that wraps the two core wires 11 at the same time, and a second outer layer that wraps around the second shielding layer By 13, the core wire 11 includes an inner conductor 111 and an insulator layer 112 wrapped around the inner conductor, the insulator layer 112 is made of FEP material, and the shape of the insulator layer 112 is a lotus-shaped porous structure.

[0022] The Quad Small Form-Factor Pluggable ...

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Abstract

The invention discloses an interface line of QSFP small package with four channels, including eight-strand core groups, first shielding layers wrapping the eight-strand core groups up and first coverscovering the first shielding layers. Every core group includes two cores. At the same time, these two cores are covered by second shielding layers and the shielding layers are covered by second covers. The core includes an inner conductor, an insulating layer covering the inner conductor. The insulating layer is made up with FEP material. The insulating layer is in the shape of a lotus root and is with a vesicular structure. The interface line of QSFP small package with four channels has high insulation flame retardant, hot properties and is capable of dramatically reducing the dielectric coefficient and the signal attenuation loss.

Description

technical field [0001] The invention relates to the technical field of electronic signal wires, in particular to a QSFP four-channel small package interface wire. Background technique [0002] QSFP (Quad Small Form-factor Pluggable): Four-channel SFP interface (QSFP), QSFP was born to meet the market's demand for higher-density, high-speed pluggable solutions. The transfer rate of this 4-channel pluggable interface has reached more than 40Gbps. [0003] Chinese patent ZL201520300136.4 discloses a low-noise QSFP transmission line, including an eight-strand core group, a shielding layer wrapped outside the eight-strand core group, and an outer jacket wrapped outside the shielding layer; each of the The wire core group includes two core wires, a first aluminum foil layer wrapping the two core wires at the same time, and a first mylar wrapped outside the first aluminum foil layer; the core wires include conductors and wrapping on Insulation layer outside the conductor. At pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B3/44H01B7/02H01B7/17H01B7/295
Inventor 贾利宾于国庆李军
Owner DONGGUAN KINGSIGNAL ELECTRONICS CO LTD