Simple screen plate manufacturing method suitable for pasting chip

Abstract

The invention discloses a simple screen plate manufacturing method suitable for pasting a chip, and the method comprises the following steps: A, data making: carrying out the making of laser cutting data and the making of FR4 plate drilling data, so as to design a simple screen plate positioning hole and an FR4 plate positioning hole; B, screen plate machining: carrying out the rough shape cuttingof a double-side substrate and an FR4 plate which are the same in size, machining the double-side substrate according to the laser cutting data, and machining the FR4 plate according to the FR4 platedrilling data; C, solder paste printing: taking a flexible circuit board to serve as a to-be-processed product, enabling a positioning hole of the product to be aligned with the positioning hole of the FR4 plate and to be disposed on the FR4 plate in a sleeved manner, enabling the cut double-side substrate to sleeve the product in a direction, printing solder paste on the product in a mode of manual printing, and obtaining a simple screen plate which is suitable for pasting the chip. The method is high in production efficiency, is high in adaptability, is low in cost, and is convenient to process.

Description

technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular to a method for making a simple screen plate suitable for patching. Background technique [0002] For flexible circuit board samples that require soldering of components, since the number of components to be soldered for each piece of product is increasing, and the size of the components is getting smaller and smaller, the manual soldering method is not only extremely low in production efficiency , At the same time, it is becoming more and more difficult to guarantee the welding quality, so the manual welding method is rarely used for the welding of the components of the flexible circuit board sample, and the SMT chip is the best way to ensure the welding quality of the components. However, due to the small number of samples of each model and the large number of models, SMT patches need to make stencils for solder paste printing, and the overall cost will be...

AI Technical Summary

Problems solved by technology

[0002] For flexible circuit board samples that require soldering of components, since the number of components to be soldered for each piece of product is increasing, and the size of components is getting smaller and smaller, manual soldering is not only extremely low in production efficiency At the same time, the welding quality is becoming more and more difficult to guarantee, so the manual welding method is rarely used for the welding of the components of the flexible circuit board sample, and the way of using SMT patch is the best way to ensure the welding quality of the components

However, due to the small quantity of each sample and the large number of models, SMT patches need to make stencils for solder paste printing, and the overall cost will be quite high. In the market, the average price of stencils for each sample is 250 Yuan calculation (the price of a simple steel mesh is generally around 200 yuan, while the price of a complex steel mesh will reach 300-500 yuan a piece)

In daily use, samples are uncertain (that is, there may be subsequent optimization and changes), and the proportion of samples that can be converted into batches is generally only about 30%. Once samples are changed, optimized, or samples cannot be converted into batches, All the stencils opened will be completely waste products, which will cause waste of stencils, resulting in a great waste of funds and resources

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