A method for improving poor exposure of metal base thick copper plate
A thick copper plate, metal-based technology, applied in the direction of printed circuits, electrical components, printed circuit manufacturing, etc., to improve the placement of solder resist thick copper poor exposure, facilitate detection, and prevent poor exposure.
Active Publication Date: 2020-08-11
KINWONG ELECTRONICS TECH LONGCHUAN
View PDF12 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] Aiming at the deficiencies of the prior art, the present invention provides a method for improving the poor exposure of the metal-based thick copper plate, which solves the difficulty in making the solder mask due to the design requirements of the current metal-based thick copper plate, such as in two Solder-proof LOGO is designed between the copper pads. Since the copper pads on both sides are thick copper with a high height, the film at the LOGO position cannot adhere to the board surface during exposure, resulting in poor exposure. Therefore, it is necessary to optimize the film design to improve this problem. This article The invention provides a film design method that can effectively improve the problem of poor exposure
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0031] like figure 1 As shown, the present invention provides a technical solution: a method for improving poor exposure of a metal-based thick copper plate, the specific steps of which are as follows:
[0032] S1. A layer of photoresist layer 2 is coated on the surface of the copper plate 1. By setting the photoresist layer 2, photolithography is a main process in the production of planar transistors and integrated circuits. Alignmen...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a method for improving poor exposure of anti-welding thick copper, which specifically includes the following steps: the surface of a copper plate is coated with a photoresist layer, the copper plate is placed and fixed on two symmetrical connecting blocks, and a work plate is fixedly connected at the bottom of the connecting blocks; and a small transparent film is fixedly installed on the top of the photoresist layer, a fixing member is lapped on the top of the small film, L-shaped plates are fixedly connected to the left and right sides of the fixing member, and a telescopic spring is fixedly connected to the bottom of each L-shaped plate. In the prior art, the copper plate will be jacked up in anti-welding exposure, so that the copper plate cannot closely cling tothe white oil surface, and light will shine on the white oil surface from the side to cause poor exposure. In the invention, as a small transparent film is fixed on the surface of the copper plate, the thickness of the copper plate at the position is increased. Thus, the photoresist layer can tightly press the copper plate at the position during vacuum pumping to make the copper plate closely cling to the white oil surface, and poor exposure is prevented.
Description
technical field [0001] The invention relates to the technical field of solder resist thick copper exposure, in particular to a method for improving poor exposure of a metal-based thick copper plate. Background technique [0002] The names of circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards Thin circuit boards and printed (copper etching technology) circuit boards, etc. Circuit boards make circuits miniaturized and intuitive, and play an important role in mass production of fixed circuits and optimized layout of electrical appliances. The circuit board can be called a printed circuit board or a printed circuit board. The English name is (Printed Circuit Board) PCB, (Flexible Printed Circuit board) FPC circuit board (FPC circuit board, also k...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/02
Inventor 邹子誉
Owner KINWONG ELECTRONICS TECH LONGCHUAN